XC5VLX50-2FF324I

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Mfr.Part #
XC5VLX50-2FF324I
Manufacturer
AMD Xilinx
Package / Case
FCBGA
Datasheet
Download
Description
IC FPGA 220 I/O 324FCBGA
Stock
19,456
In Stock :
19,456

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Terminal Form :
Ball
Max Operating Temperature :
100°C
Number of Logic Elements/Cells :
46080
Supply Voltage :
1V
Supply Voltage-Max (Vsup) :
1.05V
Speed Grade :
2
JESD-609 Code :
e0
Package / Case :
FCBGA
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Pin Count :
324
ECCN Code :
3A991.D
Number of Pins :
324
Number of Outputs :
220
Length :
19mm
Number of Logic Blocks (LABs) :
3600
Operating Supply Voltage :
1V
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Width :
19mm
Terminal Position :
BOTTOM
RAM Size :
216kB
Number of I/O :
220
Pbfree Code :
No
Terminal Finish :
Tin/Lead (Sn63Pb37)
RoHS Status :
RoHS Compliant
Number of Terminations :
324
Peak Reflow Temperature (Cel) :
225
Mount :
Surface Mount
Min Operating Temperature :
-40°C
Datasheets
XC5VLX50-2FF324I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX50-2FF324I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:FCBGA, Number of Pins:324, Number of Terminations:324, XC5VLX50-2FF324I pinout, XC5VLX50-2FF324I datasheet PDF, XC5VLX50-2FF324I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX50-2FF324I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX50-2FF324I


FPGAs AMD Xilinx XC5VLX50-2FF324I Overview

The FPGAs AMD Xilinx XC5VLX50-2FF324I represents a powerful, versatile, and highly capable integrated circuit designed for complex digital processing tasks. Developed by AMD Xilinx, a leader in programmable logic solutions, this FPGA model features an array of programmable logic blocks and a significant amount of I/O interfaces, making it suitable for a wide range of applications, from industrial automation to high-speed data processing. The component is encapsulated in a 324-pin flip-chip ball grid array (FCBGA) package, ensuring robust physical protection and reliable connectivity, essential for high-density and high-performance electronic assemblies.

XC5VLX50-2FF324I Features

This FPGA model is equipped with 220 I/O ports which provide substantial flexibility in interfacing with other components and systems. The XC5VLX50-2FF324I is engineered using leading-edge technology that supports high-speed signal processing capabilities essential for handling complex algorithms and data-intensive tasks. Its compact 324FCBGA packaging not only maximizes space efficiency but also enhances thermal management, crucial for maintaining performance stability under varying operational conditions.

XC5VLX50-2FF324I Applications

  • Communications Infrastructure: Utilized in the development of telecommunications equipment, the XC5VLX50-2FF324I can handle multiple data streams simultaneously, essential for routers, switches, and base station development.
  • Industrial Automation: In automation and control systems, this FPGA allows for the integration of complex machine control algorithms and real-time processing which are critical for robotics and automated assembly lines.
  • Automotive Technology: Applied in advanced driver-assistance systems (ADAS), the XC5VLX50-2FF324I supports the rapid processing of sensory data, vital for real-time decision-making in safety-critical applications.
  • Consumer Electronics: The chip's ability to process high volumes of data at high speeds makes it ideal for consumer electronics such as high-definition video processing devices and complex digital audio systems.
  • Medical Devices: Used in medical imaging systems, the XC5VLX50-2FF324I supports detailed image processing and data analysis, necessary for diagnostic equipment like MRI and ultrasound machines.
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