XC5VLX30-3FF324C

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Mfr.Part #
XC5VLX30-3FF324C
Manufacturer
AMD Xilinx
Package / Case
324-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 220 I/O 324FCBGA
Stock
61
In Stock :
61

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
1V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e0
Number of I/O :
220
Number of Pins :
324
Power Supplies :
12.5V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Total RAM Bits :
1179648
RAM Size :
144kB
Length :
19mm
Number of LABs/CLBs :
2400
Mounting Type :
Surface Mount
Operating Supply Voltage :
1V
Clock Frequency :
1412MHz
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
225
Number of Outputs :
220
Voltage - Supply :
0.95V~1.05V
Number of Logic Elements/Cells :
30720
Height Seated (Max) :
2.85mm
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Terminal Pitch :
1mm
Published :
1999
Pin Count :
324
RoHS Status :
Non-RoHS Compliant
Package / Case :
324-BBGA, FCBGA
Width :
19mm
Qualification Status :
Not Qualified
Series :
Virtex®-5 LX
Speed Grade :
3
Number of Terminations :
324
Packaging :
Tray
Factory Lead Time :
10 Weeks
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Base Part Number :
XC5VLX30
Operating Temperature :
0°C~85°C TJ
Datasheets
XC5VLX30-3FF324C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF324C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:324, Mounting Type:Surface Mount, Package / Case:324-BBGA, FCBGA, Number of Terminations:324, Base Part Number:XC5VLX30, Operating Temperature:0°C~85°C TJ, XC5VLX30-3FF324C pinout, XC5VLX30-3FF324C datasheet PDF, XC5VLX30-3FF324C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-3FF324C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-3FF324C


FPGAs AMD Xilinx XC5VLX30-3FF324C Overview

The AMD Xilinx XC5VLX30-3FF324C FPGA is a highly flexible and powerful integrated circuit designed for specialized computing tasks. This device is part of the broader family of Field Programmable Gate Arrays (FPGAs), which are renowned for their adaptability and efficiency in handling complex digital computations. The XC5VLX30-3FF324C offers an excellent balance between performance and cost, making it an ideal choice for developers looking to harness the power of FPGAs in their applications. With its robust 324-pin Flip-Chip Ball Grid Array (FCBGA) package and 220 I/O pins, this FPGA provides ample connectivity for a variety of design needs, ensuring compatibility and ease of integration into existing systems.

XC5VLX30-3FF324C Features

The AMD Xilinx XC5VLX30-3FF324C FPGA boasts a range of features that enhance its usability and performance in complex electronic designs. Key attributes include:

  • High I/O count: With 220 input/output pins, this FPGA offers extensive interfacing capabilities.
  • Compact 324FCBGA packaging: Ensures a reduced footprint while providing robust connectivity in a dense and efficient layout.
  • Advanced programmable logic: Allows for custom configuration to meet specific application demands, making it highly versatile across different industries.

XC5VLX30-3FF324C Applications

  • Telecommunications Equipment: Used in the development of routers and switches, the XC5VLX30-3FF324C can handle complex signal processing tasks, enhancing network efficiency and speed.
  • Automotive Systems: Integrates into automotive safety and control systems, providing the necessary processing power for advanced driver-assistance systems (ADAS).
  • Industrial Automation: Serves as a critical component in programmable logic controllers (PLCs), improving real-time control and operational efficiency in manufacturing processes.
  • Consumer Electronics: Supports high-performance requirements in devices like high-definition televisions and gaming consoles, where speed and reliability are paramount.
  • Medical Devices: Utilized in medical imaging systems, where its processing capabilities help in delivering sharper images and faster analysis for better diagnosis.
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