XC5VLX30-2FF676I

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Mfr.Part #
XC5VLX30-2FF676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
28,231
In Stock :
28,231

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
400
Number of LABs/CLBs :
2400
Packaging :
Tray
Pin Count :
676
Pbfree Code :
No
Number of Pins :
676
JESD-609 Code :
e0
Terminal Finish :
Tin/Lead (Sn63Pb37)
Factory Lead Time :
10 Weeks
Package / Case :
676-BBGA, FCBGA
Operating Supply Voltage :
1V
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1V
Mount :
Surface Mount
Terminal Form :
Ball
Operating Temperature :
-40°C~100°C TJ
Length :
27mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Number of Terminations :
676
Number of I/O :
400
Base Part Number :
XC5VLX30
Voltage - Supply :
0.95V~1.05V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Series :
Virtex®-5 LX
Number of Logic Elements/Cells :
30720
Height Seated (Max) :
3mm
Width :
27mm
Terminal Position :
BOTTOM
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
225
Published :
1999
RoHS Status :
Non-RoHS Compliant
RAM Size :
144kB
Total RAM Bits :
1179648
Speed Grade :
1
Datasheets
XC5VLX30-2FF676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FF676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:676, Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Number of Terminations:676, Base Part Number:XC5VLX30, XC5VLX30-2FF676I pinout, XC5VLX30-2FF676I datasheet PDF, XC5VLX30-2FF676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FF676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-2FF676I


FPGAs AMD Xilinx XC5VLX30-2FF676I Overview

The AMD Xilinx XC5VLX30-2FF676I is a high-performance Field Programmable Gate Array (FPGA) designed for versatile applications requiring intensive processing and high I/O bandwidth. This FPGA is crafted in a 676-pin flip-chip ball grid array (FCBGA) package, ensuring robust physical integration and reliability. The XC5VLX30-2FF676I stands out for its ability to support complex digital computations while providing the flexibility of field programmability. This capability makes it a prime choice for designers looking to develop advanced digital systems with the need for rapid prototyping and frequent updates.

XC5VLX30-2FF676I Features

The XC5VLX30-2FF676I FPGA is equipped with 400 I/O pins, offering extensive connectivity options and flexibility for various design requirements. Its high I/O count is essential for applications requiring numerous parallel inputs and outputs, such as data-intensive communication systems. The FPGA architecture is optimized for reduced power consumption and increased performance efficiency, making it suitable for high-speed computing tasks and minimizing operational costs.

XC5VLX30-2FF676I Applications

  • Telecommunications Infrastructure

    This FPGA is ideal for deployment in telecommunications equipment, where high data throughput and system reliability are critical. Its extensive I/O capabilities can handle multiple data streams, aiding in efficient signal processing and management.

  • Industrial Automation

    In industrial settings, the XC5VLX30-2FF676I can be utilized to control complex machinery with precision. Its programmability allows for custom logic designs that can adapt to varying automation tasks, enhancing operational efficiency and adaptability.

  • Medical Imaging Systems

    With its robust processing power, the XC5VLX30-2FF676I supports the high-resolution and real-time processing demands of medical imaging systems. It enables faster data processing, contributing to more accurate diagnostics and patient care.

  • Defense and Aerospace

    This FPGA's advanced features and high reliability make it suitable for use in defense and aerospace applications, where systems must operate flawlessly under extreme conditions. It provides the necessary computational capabilities and resilience needed in critical missions.

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