XC5VLX30-2FF676C

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Mfr.Part #
XC5VLX30-2FF676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
3
In Stock :
3

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Qualification Status :
Not Qualified
Pin Count :
676
RAM Size :
144kB
Number of Terminations :
676
Package / Case :
676-BBGA, FCBGA
Operating Supply Voltage :
1V
Number of Outputs :
400
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Height Seated (Max) :
3mm
Packaging :
Tray
Terminal Pitch :
1mm
Factory Lead Time :
10 Weeks
Pbfree Code :
No
Supply Voltage :
1V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Reach Compliance Code :
not_compliant
Peak Reflow Temperature (Cel) :
225
JESD-609 Code :
e0
Number of I/O :
400
Mount :
Surface Mount
ECCN Code :
3A991.D
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
1179648
Speed Grade :
2
Published :
1999
Terminal Form :
Ball
Terminal Position :
BOTTOM
Base Part Number :
XC5VLX30
Number of Pins :
676
Number of Logic Elements/Cells :
30720
Number of LABs/CLBs :
2400
Voltage - Supply :
0.95V~1.05V
Operating Temperature :
0°C~85°C TJ
Series :
Virtex®-5 LX
Terminal Finish :
Tin/Lead (Sn63Pb37)
Datasheets
XC5VLX30-2FF676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FF676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC5VLX30, Number of Pins:676, Operating Temperature:0°C~85°C TJ, XC5VLX30-2FF676C pinout, XC5VLX30-2FF676C datasheet PDF, XC5VLX30-2FF676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-2FF676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-2FF676C


FPGAs AMD Xilinx XC5VLX30-2FF676C Overview

The AMD Xilinx XC5VLX30-2FF676C is a high-performance FPGA (Field Programmable Gate Array) designed to meet the needs of demanding applications requiring high-speed data processing and versatile I/O capabilities. This advanced IC integrates a robust array of features within its 676-pin flip-chip ball grid array (FCBGA) package, offering substantial flexibility for system designers. With its efficient architecture and powerful configuration options, the FPGAs AMD Xilinx XC5VLX30-2FF676C is ideal for applications that require both complex logic operations and high data throughput.

XC5VLX30-2FF676C Features

  • 400 I/O pins providing extensive connectivity options.
  • Embedded high-speed transceivers enable enhanced data transmission rates.
  • Support for advanced digital signal processing.
  • Energy-efficient design minimizes power consumption.
  • Scalable FPGA architecture facilitates easy integration into various hardware setups.

XC5VLX30-2FF676C Applications

  • Telecommunications: Utilized in network infrastructure to facilitate high-speed data transmission and signal processing.
  • Aerospace and Defense: Employs robust processing capabilities for navigation systems and onboard data handling.
  • Consumer Electronics: Drives sophisticated functionalities in devices such as high-resolution video systems and virtual reality platforms.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple data streams from sensors and cameras.
  • Industrial Automation: Manages control systems and processes large volumes of sensor data for real-time operation and monitoring.
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