XC5VLX30-1FFG324C

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Mfr.Part #
XC5VLX30-1FFG324C
Manufacturer
AMD Xilinx
Package / Case
324-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 220 I/O 324FCBGA
Stock
440
In Stock :
440

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Terminal Form :
Ball
REACH SVHC :
Unknown
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
1
Voltage - Supply :
0.95V~1.05V
Width :
19mm
Pin Count :
324
Base Part Number :
XC5VLX30
Qualification Status :
Not Qualified
Number of I/O :
220
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Length :
19mm
Supply Voltage :
1V
JESD-609 Code :
e1
Number of Terminations :
324
Mount :
Surface Mount
Number of Logic Elements/Cells :
30720
Pbfree Code :
yes
Operating Temperature :
0°C~85°C TJ
Number of LABs/CLBs :
2400
Published :
1999
Height :
2.25mm
Factory Lead Time :
10 Weeks
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Macro Cells :
330000
Number of Pins :
324
Peak Reflow Temperature (Cel) :
250
Series :
Virtex®-5 LX
Package / Case :
324-BBGA, FCBGA
Total RAM Bits :
1179648
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
144kB
Number of Outputs :
220
Datasheets
XC5VLX30-1FFG324C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-1FFG324C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC5VLX30, Mounting Type:Surface Mount, Number of Terminations:324, Operating Temperature:0°C~85°C TJ, Number of Pins:324, Package / Case:324-BBGA, FCBGA, XC5VLX30-1FFG324C pinout, XC5VLX30-1FFG324C datasheet PDF, XC5VLX30-1FFG324C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX30-1FFG324C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX30-1FFG324C


FPGAs AMD Xilinx XC5VLX30-1FFG324C Overview

The FPGAs AMD Xilinx XC5VLX30-1FFG324C is a highly versatile, field-programmable gate array designed to meet the demanding needs of modern digital circuits. Engineered by AMD Xilinx, this FPGA features a robust architecture housed in a 324-pin flip-chip ball grid array (FCBGA) package, ensuring a compact form factor without sacrificing performance. With its 220 I/O options, it provides ample flexibility for a variety of applications, ranging from complex digital signal processing to high-speed networking solutions. This FPGA is particularly suited for designers looking for a scalable solution that can adapt to changing requirements while maintaining high levels of reliability and performance.

XC5VLX30-1FFG324C Features

This specific model of FPGA offers a broad range of features designed to support advanced and flexible design strategies. Notably, the XC5VLX30-1FFG324C integrates seamlessly into systems requiring high-speed data processing and extensive input/output capabilities. Its compact 324FCBGA package ensures that it can fit into space-constrained applications while providing the connectivity necessary for comprehensive digital communication and control.

XC5VLX30-1FFG324C Applications

  • Telecommunications Equipment: Utilized in routers and switches, the XC5VLX30-1FFG324C manages data flow efficiently, ensuring high-speed internet and network reliability.
  • Automotive Systems: Integral to advanced driver-assistance systems (ADAS), this FPGA processes multiple inputs from automotive sensors to perform real-time decision making.
  • Medical Devices: In critical medical equipment like imaging systems, the XC5VLX30-1FFG324C facilitates the rapid processing of complex data, improving diagnostic accuracy.
  • Consumer Electronics: Used in devices such as high-definition television sets and gaming consoles, the FPGA enhances processing capabilities, supporting richer multimedia experiences.
  • Industrial Automation: This FPGA is crucial in managing control systems within automated production lines, optimizing efficiency and monitoring critical operational parameters.
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