XC5VLX155-2FFG1760C

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Mfr.Part #
XC5VLX155-2FFG1760C
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 800 I/O 1760FCBGA
Stock
22,308
In Stock :
22,308

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
245
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Reach Compliance Code :
not_compliant
Operating Temperature :
0°C~85°C TJ
Base Part Number :
XC5VLX155
Number of LABs/CLBs :
12160
Series :
Virtex®-5 LX
Mounting Type :
Surface Mount
Speed Grade :
2
RAM Size :
864kB
Qualification Status :
Not Qualified
Number of Outputs :
800
Package / Case :
1760-BBGA, FCBGA
Number of Logic Elements/Cells :
155648
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.95V~1.05V
Published :
1999
Total RAM Bits :
7077888
Factory Lead Time :
10 Weeks
Contact Plating :
Copper, Silver, Tin
JESD-609 Code :
e1
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1V
Height Seated (Max) :
3.5mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Pins :
1760
Mount :
Surface Mount
ECCN Code :
3A001.A.7.A
Terminal Form :
Ball
Packaging :
Tray
Number of I/O :
800
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX155-2FFG1760C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:XC5VLX155, Mounting Type:Surface Mount, Package / Case:1760-BBGA, FCBGA, Number of Pins:1760, XC5VLX155-2FFG1760C pinout, XC5VLX155-2FFG1760C datasheet PDF, XC5VLX155-2FFG1760C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX155-2FFG1760C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX155-2FFG1760C


FPGAs AMD Xilinx XC5VLX155-2FFG1760C Overview

The FPGAs AMD Xilinx XC5VLX155-2FFG1760C is a high-performance, field-programmable gate array designed to meet the demanding requirements of high-throughput systems. This FPGA integrates a robust feature set suitable for handling complex digital processing tasks in a compact 1760-pin flip-chip ball grid array (FCBGA) package. Its adaptability and processing power make it ideal for developers looking to push the boundaries of technology in high-speed communications and advanced digital signal processing.

XC5VLX155-2FFG1760C Features

The XC5VLX155-2FFG1760C from AMD Xilinx offers an extensive array of features, including support for up to 800 I/O pins, allowing for versatile connections to other components in high-end system designs. The FPGA's high integration level supports increased functionality while maintaining a smaller footprint, making it suitable for dense board configurations in industrial applications.

XC5VLX155-2FFG1760C Applications

  • Data Centers: Utilized in server architectures to accelerate data processing and bandwidth management, ensuring efficient data flow and lower latency.
  • Telecommunications: Employs in communication infrastructure to manage signal processing tasks, enhancing the efficiency of network systems and supporting the deployment of next-generation network technologies.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time sensor data, facilitating quicker decision-making and increasing road safety.
  • Medical Imaging: Used in medical diagnostic equipment to handle complex image processing tasks, improving the clarity and accuracy of medical imaging technologies such as MRI and CT scans.
  • Video Surveillance: Implemented in high-definition video surveillance systems to enable real-time video analysis and object recognition, enhancing security protocols and response strategies.
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