XC5VLX110-3FFG676C

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Mfr.Part #
XC5VLX110-3FFG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 440 I/O 676FCBGA
Stock
20,840
In Stock :
20,840

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Number of LABs/CLBs :
8640
Factory Lead Time :
10 Weeks
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®-5 LX
Terminal Position :
BOTTOM
Length :
27mm
Peak Reflow Temperature (Cel) :
245
Width :
27mm
Power Supplies :
12.5V
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Base Part Number :
XC5VLX110
Voltage - Supply :
0.95V~1.05V
Mount :
Surface Mount
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Terminal Form :
Ball
RAM Size :
576kB
Reach Compliance Code :
not_compliant
Supply Voltage :
1V
Clock Frequency :
1412MHz
Total RAM Bits :
4718592
Number of Outputs :
440
Operating Supply Voltage :
1V
RoHS Status :
ROHS3 Compliant
Published :
1999
Number of Logic Elements/Cells :
110592
Pin Count :
676
Package / Case :
676-BBGA, FCBGA
Number of Terminations :
676
JESD-609 Code :
e1
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade :
3
Number of I/O :
440
Number of Pins :
676
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX110-3FFG676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Base Part Number:XC5VLX110, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, Number of Pins:676, XC5VLX110-3FFG676C pinout, XC5VLX110-3FFG676C datasheet PDF, XC5VLX110-3FFG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VLX110-3FFG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VLX110-3FFG676C


FPGAs AMD Xilinx XC5VLX110-3FFG676C Overview

The FPGAs AMD Xilinx XC5VLX110-3FFG676C represents a cutting-edge field programmable gate array designed to meet the demanding needs of high-performance computing environments. Manufactured by AMD Xilinx, this FPGA is ideal for developers looking to deploy intensive computational tasks with flexibility and high throughput. The XC5VLX110-3FFG676C is built on a robust 676-pin flip-chip ball grid array (FCBGA) package, providing substantial I/O capabilities that are essential for complex digital circuits. This device offers a versatile solution for applications requiring fast processing and significant logic density, making it a premier choice for both innovation and scale.

XC5VLX110-3FFG676C Features

The XC5VLX110-3FFG676C FPGA is equipped with 440 I/O pins, allowing for extensive connectivity and integration options for various system components. It features a high-capacity logic layout, enabling it to support intricate algorithm implementations and data processing tasks. This FPGA's adaptability and performance are suitable for creating sophisticated, customizable logic circuits and handling multiple functionalities in parallel.

XC5VLX110-3FFG676C Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the XC5VLX110-3FFG676C can manage vast data flows, improving bandwidth and reducing latency in network systems.
  • Data Centers: This FPGA accelerates data processing tasks, supporting cloud computing infrastructures by enhancing data throughput and energy efficiency.
  • Medical Imaging: In devices such as MRI and CT scanners, the XC5VLX110-3FFG676C processes complex imaging algorithms quickly, contributing to faster and more accurate diagnostics.
  • Aerospace and Defense: Applied in radar and communication systems, this FPGA ensures reliable data encryption and real-time processing critical for defense applications.
  • Automotive Technology: Supports advanced driver-assistance systems (ADAS) by processing real-time sensor data, aiding in navigation and vehicle safety.
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