XC5VFX70T-3FF1136C

Share

Or copy the link below:

Mfr.Part #
XC5VFX70T-3FF1136C
Manufacturer
AMD Xilinx
Package / Case
1136-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 640 I/O 1136FCBGA
Stock
7,953
In Stock :
7,953

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Peak Reflow Temperature (Cel) :
225
Number of Logic Elements/Cells :
71680
Mounting Type :
Surface Mount
Package / Case :
1136-BBGA, FCBGA
Terminal Finish :
TIN LEAD
RoHS Status :
Non-RoHS Compliant
Terminal Position :
BOTTOM
Series :
Virtex®-5 FXT
Number of LABs/CLBs :
5600
Supply Voltage :
1V
Operating Temperature :
0°C~85°C TJ
Pbfree Code :
No
Number of I/O :
640
Qualification Status :
Not Qualified
Number of Outputs :
640
RAM Size :
666kB
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Supply Voltage :
1V
JESD-609 Code :
e0
Factory Lead Time :
11 Weeks
Packaging :
Tray
Base Part Number :
XC5VFX70T
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Published :
1999
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Number of Inputs :
640
Speed Grade :
3
Terminal Pitch :
1mm
Power Supplies :
12.5V
Voltage - Supply :
0.95V~1.05V
Total RAM Bits :
5455872
Clock Frequency :
1412MHz
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VFX70T-3FF1136C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1136-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Base Part Number:XC5VFX70T, XC5VFX70T-3FF1136C pinout, XC5VFX70T-3FF1136C datasheet PDF, XC5VFX70T-3FF1136C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VFX70T-3FF1136C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VFX70T-3FF1136C


FPGAs AMD Xilinx XC5VFX70T-3FF1136C Overview

The AMD Xilinx XC5VFX70T-3FF1136C FPGA stands out in the field of high-performance programmable logic devices. This component is specifically engineered to meet the rigorous demands of applications requiring high I/O bandwidth and substantial logic capacity. The XC5VFX70T-3FF1136C from the esteemed manufacturer AMD Xilinx integrates advanced features in a compact 1136-pin flip-chip ball grid array (FCBGA) package, ensuring robust performance and reliability. Ideal for designers aiming at rapid prototyping and complex digital circuit development, this FPGA enables efficient and flexible system design, making it a cornerstone in the development of high-tech solutions.

XC5VFX70T-3FF1136C Features

The XC5VFX70T-3FF1136C FPGA by AMD Xilinx offers a comprehensive suite of features designed to support complex digital processing needs. It provides 640 user I/O pins, allowing for versatile connections and interfaces with other system components. The device's substantial logic density supports intensive processing tasks and data management in real-time applications. This FPGA also ensures lower power consumption and improved heat management, critical for maintaining system stability and longevity in high-demand environments.

XC5VFX70T-3FF1136C Applications

  • Data Centers: In modern data centers, the XC5VFX70T-3FF1136C can be utilized for managing high-speed data processing tasks, supporting server virtualization, and handling complex algorithms efficiently.
  • Telecommunications: This FPGA is ideal for telecom infrastructure, enabling robust digital signal processing, which is essential for network management and expansion capabilities.
  • Automotive Technology: Employed in advanced driver-assistance systems (ADAS), the XC5VFX70T-3FF1136C helps in processing inputs from various sensors quickly, enhancing vehicle safety and automation.
  • Medical Imaging: With its high processing power, the FPGA can be utilized in medical imaging devices, assisting in the quick rendering of complex images and supporting real-time diagnostics.
  • Aerospace and Defense: The FPGA’s robust design is suitable for aerospace applications, where it handles navigation and control systems, ensuring reliability under extreme conditions.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM