XC4VLX25-11SF363C

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Mfr.Part #
XC4VLX25-11SF363C
Manufacturer
AMD Xilinx
Package / Case
363-FBGA, FCBGA
Datasheet
Download
Description
IC FPGA 240 I/O 363FCBGA
Stock
41,031
In Stock :
41,031

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RAM Size :
162kB
Package / Case :
363-FBGA, FCBGA
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.2V
Mounting Type :
Surface Mount
ECCN Code :
3A991.D
Terminal Position :
BOTTOM
Total RAM Bits :
1327104
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Series :
Virtex®-4 LX
JESD-609 Code :
e0
Terminal Pitch :
0.8mm
Factory Lead Time :
10 Weeks
Length :
17mm
Number of LABs/CLBs :
2688
Terminal Finish :
Tin/Lead (Sn63Pb37)
Packaging :
Bulk
Pbfree Code :
No
Operating Supply Voltage :
1.2V
Number of Inputs :
240
Terminal Form :
Ball
Number of Terminations :
363
Reach Compliance Code :
not_compliant
Qualification Status :
Not Qualified
Height Seated (Max) :
1.99mm
HTS Code :
8542.39.00.01
Surface Mount :
yes
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
24192
Number of Outputs :
240
Width :
17mm
Voltage - Supply :
1.14V~1.26V
Published :
1999
RoHS Status :
Non-RoHS Compliant
Number of I/O :
240
Peak Reflow Temperature (Cel) :
225
Pin Count :
363
Speed Grade :
11
JESD-30 Code :
S-PBGA-B363
Clock Frequency :
1205MHz
Datasheets
XC4VLX25-11SF363C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX25-11SF363C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:363-FBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:363, Operating Temperature:0°C~85°C TJ, XC4VLX25-11SF363C pinout, XC4VLX25-11SF363C datasheet PDF, XC4VLX25-11SF363C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX25-11SF363C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.2V V 1.99mm mm FPGAs Virtex®-4 LX Series 363-FBGA, FCBGA 0.8mm mm 363

XC4VLX25-11SF363C Overview


Fpga chips is supplied in the 363-FBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 240 I/Os for transferring data in a more coherent manner. There are 24192 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Virtex®-4 LX seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 240 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. Fpga chips is designed wFpga chipsh 363 terminations. The RAM bits that this device offer is 1327104. The RAM si162kBe of this FPGA module reaches 162kB to ensure normal operation of the program. This FPGA is built as an array of 2688 LABs/CLBs. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga semiconductor is equipped wfpga semiconductorh 363 pin count. Typically, fpga semiconductor uses a crystal oscillating at 1205MHz .

XC4VLX25-11SF363C Features


240 I/Os
Up to 1327104 RAM bits


XC4VLX25-11SF363C Applications


There are a lot of Xilinx Inc.
XC4VLX25-11SF363C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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