XC4VLX15-12FF676C

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Mfr.Part #
XC4VLX15-12FF676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 320 I/O 676FCBGA
Stock
30,603
In Stock :
30,603

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
27mm
RAM Size :
108kB
Number of Outputs :
320
Terminal Finish :
Tin/Lead (Sn63Pb37)
JESD-30 Code :
S-PBGA-B676
Number of Inputs :
320
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Factory Lead Time :
15 Weeks
Peak Reflow Temperature (Cel) :
225
Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Published :
1999
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
13824
HTS Code :
8542.39.00.01
JESD-609 Code :
e0
Total RAM Bits :
884736
Series :
Virtex®-4 LX
Number of LABs/CLBs :
1536
Number of Terminations :
676
Surface Mount :
yes
Terminal Position :
BOTTOM
Width :
27mm
Time@Peak Reflow Temperature-Max (s) :
30
Height Seated (Max) :
3mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Supply Voltage :
1.2V
Number of I/O :
320
ECCN Code :
3A991.D
Package / Case :
676-BBGA, FCBGA
Speed Grade :
12
Pin Count :
676
RoHS Status :
Non-RoHS Compliant
Terminal Form :
Ball
Voltage - Supply :
1.14V~1.26V
Datasheets
XC4VLX15-12FF676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX15-12FF676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, XC4VLX15-12FF676C pinout, XC4VLX15-12FF676C datasheet PDF, XC4VLX15-12FF676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4VLX15-12FF676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC4VLX15-12FF676C


FPGAs AMD Xilinx XC4VLX15-12FF676C Overview

The FPGAs AMD Xilinx XC4VLX15-12FF676C is an advanced field programmable gate array designed to meet the demands of high-performance, high-density applications across various industries. Manufactured by AMD Xilinx, this IC FPGA features a robust 676-pin FCBGA (flip-chip ball grid array) package that supports a wide range of input/output configurations, facilitating versatile integration into complex systems. Its architecture is engineered to deliver exceptional computational horsepower and flexibility, making it an ideal choice for designers looking to implement intricate logic circuits and system-level innovations.

XC4VLX15-12FF676C Features

The XC4VLX15-12FF676C FPGA is equipped with 320 I/O pins, providing ample flexibility for interfacing with other components and systems. This high I/O count is essential for applications requiring numerous simultaneous connections, such as data-intensive and real-time processing tasks. The device's FCBGA package enhances its reliability and thermal management capabilities, crucial for maintaining performance in demanding environments. Additionally, its compatibility with advanced digital signal processing extends its utility in complex algorithm implementations.

XC4VLX15-12FF676C Applications

  • Telecommunications: This FPGA can be used to develop high-speed network devices like routers and switches, optimizing data flow and improving bandwidth efficiency in network infrastructure.
  • Automotive Systems: The robust I/O capabilities and processing power of the XC4VLX15-12FF676C make it suitable for automotive applications, including advanced driver-assistance systems (ADAS) where real-time processing is crucial.
  • Consumer Electronics: Utilized in devices such as high-definition televisions and gaming consoles, this FPGA enhances processing capabilities, supporting richer user experiences with improved graphics and faster response times.
  • Industrial Automation: In industrial settings, the XC4VLX15-12FF676C helps in the design of control systems that require high-speed signal processing and precise real-time control, leading to increased operational efficiency.
  • Medical Devices: Its application in medical imaging equipment such as MRI and ultrasound machines demonstrates its capacity to handle complex computational tasks, aiding in faster and more accurate diagnostic procedures.
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