XC4013E-3BG225C
- Mfr.Part #
- XC4013E-3BG225C
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-BBGA
- Datasheet
- Download
- Description
- IC FPGA 192 I/O 225BGA
- Stock
- 18,089
- In Stock :
- 18,089
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 1999
- Terminal Position :
- BOTTOM
- Number of Gates :
- 13000
- Clock Frequency :
- 125MHz
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Number of LABs/CLBs :
- 576
- Package / Case :
- 225-BBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Outputs :
- 192
- Lead Free :
- Contains Lead
- Combinatorial Delay of a CLB-Max :
- 2 ns
- Number of I/O :
- 192
- Total RAM Bits :
- 18432
- Mount :
- Surface Mount
- Qualification Status :
- Not Qualified
- Packaging :
- Tray
- JESD-609 Code :
- e0
- Mounting Type :
- Surface Mount
- Number of Pins :
- 225
- Voltage - Supply :
- 4.75V~5.25V
- Peak Reflow Temperature (Cel) :
- 225
- Terminal Pitch :
- 1.5mm
- Number of Terminations :
- 225
- Operating Temperature :
- 0°C~85°C TJ
- Width :
- 27mm
- Base Part Number :
- XC4013E
- Number of Logic Elements/Cells :
- 1368
- Series :
- XC4000E/X
- Number of Equivalent Gates :
- 10000
- Power Supplies :
- 5V
- Height Seated (Max) :
- 2.55mm
- Number of CLBs :
- 576
- Length :
- 27mm
- Supply Voltage :
- 5V
- Pin Count :
- 225
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Reach Compliance Code :
- not_compliant
- RAM Size :
- 2.3kB
- RoHS Status :
- Non-RoHS Compliant
- Datasheets
- XC4013E-3BG225C

FPGAs AMD Xilinx XC4013E-3BG225C Overview
The FPGAs AMD Xilinx XC4013E-3BG225C is a highly versatile, field-programmable gate array that offers substantial benefits for a wide range of applications. Designed by AMD Xilinx, a leader in digital circuit technology, this FPGA features a robust 225-ball grid array (BGA) package that supports up to 192 programmable I/O options. This enables designers to create highly customizable and scalable hardware configurations tailored to specific needs and requirements, ensuring optimal integration and performance in complex electronic environments.
XC4013E-3BG225C Features
The XC4013E-3BG225C FPGA is equipped with multiple standout features, including its high I/O pin count, which is essential for applications requiring numerous connections and high-speed interfaces. The device's BGA packaging not only ensures a compact footprint on the PCB but also enhances thermal management and reliability under varying operational conditions. Additionally, the XC4013E-3BG225C is designed to support a wide range of voltage levels, providing flexibility in power management for diverse applications.
XC4013E-3BG225C Applications
- Telecommunications: Utilized in communication infrastructure, the XC4013E-3BG225C manages high-speed signal processing tasks which are critical for routers, switches, and base station development.
- Automotive Systems: Enhances functionality in advanced driver-assistance systems (ADAS) by processing multiple sensor inputs, ensuring real-time response and reliability.
- Consumer Electronics: Integral to the development of multimedia devices, providing the necessary processing power for video streaming devices and home entertainment systems.
- Industrial Automation: Key component in automation controllers and real-time system monitoring, improving operational efficiency and machine-to-machine communication.
- Medical Equipment: Critical in medical imaging systems, where it processes complex algorithms required for real-time imaging and diagnostic equipment.
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