XC4013E-2BG225C

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Mfr.Part #
XC4013E-2BG225C
Manufacturer
AMD Xilinx
Package / Case
225-BBGA
Datasheet
Download
Description
IC FPGA 192 I/O 225BGA
Stock
1,658
In Stock :
1,658

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
27mm
Width :
27mm
Time@Peak Reflow Temperature-Max (s) :
30
Series :
XC4000E/X
Base Part Number :
XC4013E
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Gates :
13000
Combinatorial Delay of a CLB-Max :
1.6 ns
Terminal Form :
Ball
Number of Outputs :
192
Mount :
Surface Mount
Number of CLBs :
576
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Pitch :
1.5mm
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
225
RAM Size :
2.3kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Number of Terminations :
225
Packaging :
Tray
Supply Voltage :
5V
Number of Logic Elements/Cells :
1368
Lead Free :
Contains Lead
Published :
1999
Number of Equivalent Gates :
10000
Number of I/O :
192
Reach Compliance Code :
not_compliant
Clock Frequency :
125MHz
Package / Case :
225-BBGA
Number of LABs/CLBs :
576
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
18432
Terminal Position :
BOTTOM
Pin Count :
225
Height Seated (Max) :
2.55mm
JESD-609 Code :
e0
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
4.75V~5.25V
Qualification Status :
Not Qualified
Number of Pins :
225
Power Supplies :
5V
Datasheets
XC4013E-2BG225C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4013E-2BG225C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC4013E, Mounting Type:Surface Mount, Number of Terminations:225, Package / Case:225-BBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:225, XC4013E-2BG225C pinout, XC4013E-2BG225C datasheet PDF, XC4013E-2BG225C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4013E-2BG225C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC4013E-2BG225C


FPGAs AMD Xilinx XC4013E-2BG225C Overview

The AMD Xilinx XC4013E-2BG225C is a high-performance Field Programmable Gate Array (FPGA) that is designed to meet the demanding needs of modern digital circuits. This FPGA offers a robust platform for developing complex designs with a flexible architecture and high-density logic cells. The XC4013E-2BG225C, housed in a 225-ball grid array (BGA) package, provides extensive I/O capabilities with 192 I/O pins, making it highly suitable for a wide range of applications from industrial to communication technologies. Its ability to reconfigure hardware logic on the fly not only enhances adaptability but also reduces time-to-market, making it an invaluable asset for developers looking to implement intricate logic designs and data processing algorithms.

XC4013E-2BG225C Features

This FPGA is equipped with advanced features that cater to an extensive range of applications. Key features include a large array of logic cells, support for high-speed DSP operations, and low-power consumption. The XC4013E-2BG225C’s ability to support multiple I/O standards ensures compatibility across various digital platforms, enhancing its utility in complex digital environments. Additionally, the device's programmability allows for quick iteration and deployment of designs, which is critical for meeting project deadlines in commercial and industrial settings.

XC4013E-2BG225C Applications

  • Telecommunications Infrastructure: Utilizes the FPGA's high-speed I/O and signal processing capabilities to manage and route data efficiently in communication systems.
  • Automotive Systems: Integrates into driver assistance and in-vehicle infotainment systems, benefiting from the XC4013E-2BG225C's robust processing power and reliability under varying environmental conditions.
  • Industrial Automation: Employs the FPGA to control machinery and processes, taking advantage of its ability to quickly reprogram system parameters and adapt to new automation tasks.
  • Consumer Electronics: Supports rapid development cycles in consumer electronics by enabling flexible hardware configuration and real-time processing for devices like high-definition televisions and portable computing devices.
  • Medical Devices: Critical in the deployment of medical imaging and diagnostic equipment, where precision and adaptability to different functionalities are crucial.
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