XC4010E-3BG225I

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Mfr.Part #
XC4010E-3BG225I
Manufacturer
AMD Xilinx
Package / Case
225-BBGA
Datasheet
Download
Description
IC FPGA 160 I/O 225BGA
Stock
17,302
In Stock :
17,302

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Mount :
Surface Mount
Packaging :
Tray
Width :
27mm
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
160
JESD-609 Code :
e0
Number of Terminations :
225
Power Supplies :
5V
Published :
1999
Terminal Pitch :
1.5mm
Series :
XC4000E/X
Operating Temperature :
-40°C~100°C TJ
Peak Reflow Temperature (Cel) :
225
Terminal Position :
BOTTOM
Number of LABs/CLBs :
400
Number of Outputs :
160
Number of Gates :
10000
Clock Frequency :
125MHz
Number of Pins :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
27mm
Package / Case :
225-BBGA
Total RAM Bits :
12800
Supply Voltage :
5V
Combinatorial Delay of a CLB-Max :
2 ns
Number of Equivalent Gates :
7000
Pbfree Code :
No
HTS Code :
8542.39.00.01
RAM Size :
1.6kb
Base Part Number :
XC4010E
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status :
Not Qualified
Pin Count :
225
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
950
Number of Logic Cells :
400
Voltage - Supply :
4.5V~5.5V
Lead Free :
Contains Lead
Height Seated (Max) :
2.55mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of CLBs :
400
Reach Compliance Code :
not_compliant
Datasheets
XC4010E-3BG225I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4010E-3BG225I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:225, Operating Temperature:-40°C~100°C TJ, Number of Pins:225, Package / Case:225-BBGA, Base Part Number:XC4010E, Mounting Type:Surface Mount, XC4010E-3BG225I pinout, XC4010E-3BG225I datasheet PDF, XC4010E-3BG225I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4010E-3BG225I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC4010E-3BG225I


FPGAs AMD Xilinx XC4010E-3BG225I Overview

The AMD Xilinx XC4010E-3BG225I FPGA is a state-of-the-art field-programmable gate array that provides an advanced solution for system designers aiming to harness the benefits of high-speed and high-density programmable logic. This IC FPGA integrates 160 I/O pins housed in a compact 225-BGA (Ball Grid Array) package, making it suitable for sophisticated digital processing tasks in space-constrained applications. The flexibility of the XC4010E-3BG225I makes it an optimal choice for developers looking to create scalable and adaptable hardware platforms in various technological fields.

XC4010E-3BG225I Features

This FPGA from AMD Xilinx is equipped with features that enhance its usability and functionality in complex electronic systems. Key features include a robust design that supports a wide range of digital signal processing applications, high integration capacity which allows for the minimization of external components, and enhanced system reliability through advanced error detection and correction mechanisms.

XC4010E-3BG225I Applications

  • Telecommunications: Used in communication infrastructure to manage signal processing and data flow efficiently, adapting to the demands of high-speed network environments.
  • Automotive: Ideal for automotive applications, such as advanced driver-assistance systems (ADAS), where real-time processing and reliability are critical.
  • Consumer Electronics: Can be integrated into consumer electronics, including smart TVs and gaming consoles, to enhance processing capabilities and support high-resolution graphics and user interfaces.
  • Industrial: Useful in industrial automation for controlling machinery, process management, and safety operations, thanks to its robust I/O capabilities and programmability.
  • Medical Devices: Applied in medical diagnostic equipment where precision and the ability to process complex algorithms are necessary for imaging and data analysis.
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