XC4010E-3BG225C
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- Mfr.Part #
- XC4010E-3BG225C
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-BBGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 225BGA
- Stock
- 9,766
- In Stock ：
- 9,766
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 27mm
- Package / Case :
- 225-BBGA
- Voltage - Supply :
- 4.75V~5.25V
- Number of LABs/CLBs :
- 400
- Qualification Status :
- Not Qualified
- Power Supplies :
- 5V
- Terminal Pitch :
- 1.5mm
- Base Part Number :
- XC4010E
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Equivalent Gates :
- 7000
- HTS Code :
- 8542.39.00.01
- RAM Size :
- 1.6kb
- Combinatorial Delay of a CLB-Max :
- 2 ns
- Supply Voltage :
- 5V
- Terminal Position :
- BOTTOM
- Series :
- XC4000E/X
- Number of Outputs :
- 160
- Total RAM Bits :
- 12800
- Number of Logic Cells :
- 400
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Pin Count :
- 225
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Width :
- 27mm
- Peak Reflow Temperature (Cel) :
- 225
- Number of I/O :
- 160
- Published :
- 1999
- Number of Logic Elements/Cells :
- 950
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Packaging :
- Tray
- Number of Gates :
- 10000
- Number of CLBs :
- 400
- Number of Pins :
- 225
- Pbfree Code :
- No
- Height Seated (Max) :
- 2.55mm
- Clock Frequency :
- 125MHz
- Number of Terminations :
- 225
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Reach Compliance Code :
- not_compliant
- Datasheets
- XC4010E-3BG225C
FPGAs AMD Xilinx XC4010E-3BG225C Overview
The AMD Xilinx XC4010E-3BG225C FPGA is a high-performance field-programmable gate array that provides a versatile and efficient solution for a broad range of applications. This IC is designed to meet the demanding needs of modern technology infrastructures, offering a robust suite of features including a substantial number of input/output options. The 225-ball grid array (BGA) package ensures a compact form factor while facilitating improved thermal management and lower power consumption. The flexibility of this FPGA allows it to be customized for various uses, making it an ideal choice for designers looking to create scalable and adaptable hardware architectures. Incorporating the FPGAs AMD Xilinx XC4010E-3BG225C into your designs can significantly enhance system performance and increase design longevity.
XC4010E-3BG225C Features
This FPGA module from AMD Xilinx boasts several key features, including 160 I/O ports that provide ample connectivity for complex designs. The XC4010E-3BG225C operates efficiently within the 225BGA package, ensuring that even the most space-constrained applications can be addressed. Enhanced signal integrity and lower latency are hallmark benefits, thanks to its advanced design and manufacturing techniques. This device supports a wide range of configurations and is engineered to facilitate rapid prototyping and development, speeding up time-to-market for new products.
XC4010E-3BG225C Applications
- Telecommunications: Utilized in networking equipment for data processing and signal management, enhancing bandwidth and reducing latency.
- Automotive: Deployed in vehicle systems for managing sensor data and enhancing driver-assist technologies.
- Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles to manage visual and audio processing.
- Industrial Automation: Crucial in the control systems of automated production lines, improving operational efficiency and reliability.
- Aerospace: Used in satellite and avionics systems to handle complex computations and data management tasks.
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