XC4006E-3PG156I

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Mfr.Part #
XC4006E-3PG156I
Manufacturer
AMD Xilinx
Package / Case
156-BCPGA
Datasheet
Download
Description
IC FPGA 125 I/O 156CPGA
Stock
34,645
In Stock :
34,645

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
4.5V~5.5V
Terminal Pitch :
2.54mm
Package / Case :
156-BCPGA
Total RAM Bits :
8192
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
42.164mm
Packaging :
Tray
Mounting Type :
Through Hole
Number of Outputs :
125
Number of LABs/CLBs :
256
Number of Logic Cells :
608
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
608
Published :
1999
Lead Free :
Contains Lead
Combinatorial Delay of a CLB-Max :
2 ns
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
PIN/PEG
Series :
XC4000E/X
Radiation Hardening :
No
Mount :
Through Hole
Number of Registers :
768
Number of Terminations :
156
Terminal Position :
PERPENDICULAR
Number of I/O :
125
Pin Count :
156
Supply Voltage :
5V
Number of Pins :
156
Operating Supply Voltage :
5V
Number of CLBs :
256
Number of Gates :
6000
Speed Grade :
3
Length :
42.164mm
RoHS Status :
Non-RoHS Compliant
RAM Size :
1kB
Base Part Number :
XC4006E
Power Supplies :
5V
Datasheets
XC4006E-3PG156I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC4006E-3PG156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:156-BCPGA, Mounting Type:Through Hole, Operating Temperature:-40°C~100°C TJ, Number of Terminations:156, Number of Pins:156, Base Part Number:XC4006E, XC4006E-3PG156I pinout, XC4006E-3PG156I datasheet PDF, XC4006E-3PG156I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC4006E-3PG156I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



5V V FPGAs XC4000E/X Series 156-BCPGA 2.54mm mm 156

XC4006E-3PG156I Overview


In the package 156-BCPGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 125 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 608 logic elements/cells. Supply voltage is 5V volts. By attaching the Through Hole connector, you can use this FPGA module with your development board. With a supply voltage of 4.5V~5.5V, this device operates with ease. This is a type of FPGA that is part of the XC4000E/X series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 125 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 156. Fpga electronics is worth mentioning that this device provides 8192 bfpga electronics s of RAM. XC4006E is the base part number that can be used to identify related parts. The RAM si1kBe of this FPGA module reaches 1kB so as to guarantee the normal operation of the program during operation. The device has 156 pins which are included in the design. The FPGA is built as an array of 256 latches or CLBs. I think, as long as this FPGA is mounted in Through Hole, it could perform excellently according to its specifications as long as you mount it in Through Hole. In operation with 5V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 5V. A basic building block for this type of building block consists of 6000 gates. I am going to present you with a device that is equipped with 156 pins. The structure of the registers used to store and transfer data consists of 768 registers. The architecture of the system is based on 256 CLBs. It incorporates 608 logic cells used for the building block.

XC4006E-3PG156I Features


125 I/Os
Up to 8192 RAM bits
156 LABs/CLBs
768 registers


XC4006E-3PG156I Applications


There are a lot of Xilinx Inc.
XC4006E-3PG156I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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