XC3S700AN-4FG484I
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- Mfr.Part #
- XC3S700AN-4FG484I
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 372 I/O 484FBGA
- Stock
- 1,001
- In Stock ：
- 1,001
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 484
- RAM Size :
- 45kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Operating Supply Voltage :
- 1.2V
- Package / Case :
- 484-BBGA
- Published :
- 1999
- Mount :
- Surface Mount
- Number of Gates :
- 700000
- Base Part Number :
- XC3S700AN
- Pin Count :
- 484
- Number of Logic Elements/Cells :
- 13248
- Clock Frequency :
- 667MHz
- Number of Pins :
- 484
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Operating Temperature :
- -40°C~100°C TJ
- Number of I/O :
- 372
- Number of Outputs :
- 288
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 368640
- Width :
- 23mm
- Number of LABs/CLBs :
- 1472
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 1.21.2/3.33.3V
- RoHS Status :
- Non-RoHS Compliant
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Speed Grade :
- 4
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Pbfree Code :
- No
- Factory Lead Time :
- 10 Weeks
- Length :
- 23mm
- Height Seated (Max) :
- 2.6mm
- Series :
- Spartan®-3AN
- Voltage - Supply :
- 1.14V~1.26V
- Datasheets
- XC3S700AN-4FG484I
FPGAs AMD Xilinx XC3S700AN-4FG484I Overview
The AMD Xilinx XC3S700AN-4FG484I is a state-of-the-art FPGA (Field Programmable Gate Array) designed to meet the increasing demands of high-speed, high-performance applications across various industries. This advanced IC FPGA features 372 I/O pins housed in a 484-pin FBGA package, offering superior flexibility and functionality. The robust design and versatile nature of the XC3S700AN-4FG484I make it an ideal choice for designers looking to push the boundaries of technology with scalable digital circuitry. Its adaptability and efficiency in handling complex algorithms and data-intensive tasks allow it to excel in a wide range of settings, ensuring optimal performance and reliability.
XC3S700AN-4FG484I Features
- 372 I/O pins for extensive connectivity and interfacing capabilities.
- Dense 484 FBGA packaging enables compact and efficient design layouts.
- Highly flexible and programmable architecture suitable for numerous custom applications.
- Robust design capable of withstanding rigorous operational conditions.
- Optimized for low power consumption, enhancing system efficiency and longevity.
XC3S700AN-4FG484I Applications
- Telecommunications Equipment: Utilized in routers and switches for data processing and signal integrity management.
- Automotive Electronics: Enhances functionality in driver assistance systems and infotainment modules by providing robust, programmable solutions.
- Medical Devices: Critical in the development of medical imaging systems such as MRI and ultrasound equipment, ensuring precise data handling and real-time processing.
- Consumer Electronics: Employs in smart home devices and high-performance gaming consoles, offering flexibility in user interface and connectivity solutions.
- Industrial Automation: Integral in controlling machinery and processes, ensuring high reliability and adaptability in harsh industrial environments.
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