XC3S700A-4FGG484C

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Mfr.Part #
XC3S700A-4FGG484C
Manufacturer
AMD Xilinx
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 372 I/O 484FBGA
Stock
33,365
In Stock :
33,365

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
3A991.D
Voltage - Supply :
1.14V~1.26V
Length :
23mm
Factory Lead Time :
10 Weeks
Series :
Spartan®-3A
Peak Reflow Temperature (Cel) :
250
Pbfree Code :
yes
Mounting Type :
Surface Mount
Power Supplies :
1.22.5/3.3V
RoHS Status :
ROHS3 Compliant
Frequency :
250MHz
Number of LABs/CLBs :
1472
Published :
1999
Packaging :
Tray
Terminal Pitch :
1mm
Total RAM Bits :
368640
Operating Supply Voltage :
1.2V
RAM Size :
45kB
Package / Case :
484-BBGA
Width :
23mm
Supply Voltage :
1.2V
Number of Outputs :
288
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Mount :
Surface Mount
Number of Logic Elements/Cells :
13248
Number of I/O :
372
Combinatorial Delay of a CLB-Max :
0.71 ns
Number of Gates :
700000
Terminal Form :
Ball
JESD-609 Code :
e1
Termination :
SMD/SMT
Number of Pins :
484
Height Seated (Max) :
2.6mm
Base Part Number :
XC3S700A
Number of Terminations :
484
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade :
4
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
484
REACH SVHC :
Unknown
Time@Peak Reflow Temperature-Max (s) :
30
Qualification Status :
Not Qualified
Datasheets
XC3S700A-4FGG484C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S700A-4FGG484C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:484-BBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:484, Base Part Number:XC3S700A, Number of Terminations:484, XC3S700A-4FGG484C pinout, XC3S700A-4FGG484C datasheet PDF, XC3S700A-4FGG484C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S700A-4FGG484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S700A-4FGG484C


FPGAs AMD Xilinx XC3S700A-4FGG484C Overview

The FPGAs AMD Xilinx XC3S700A-4FGG484C is a highly versatile integrated circuit designed for advanced digital processing needs. Crafted by AMD Xilinx, a leader in digital design technology, this FPGA is engineered to support a wide array of applications requiring substantial logic and I/O handling capabilities. With its robust 484FBGA packaging, the XC3S700A-4FGG484C offers a compact yet powerful solution for both high-speed and high-density integration. This product is ideal for designers aiming to achieve rapid prototyping and production through a reliable, high-performance platform.

XC3S700A-4FGG484C Features

The XC3S700A-4FGG484C FPGA includes 372 I/O ports, enabling extensive connectivity options for various peripherals and systems. It supports a 4-speed grade, which is optimal for balancing performance and power consumption. Encased in a 484-pin fine-pitch ball grid array (FBGA), it ensures a minimized footprint on system boards, making it suitable for dense and complex electronic assemblies.

XC3S700A-4FGG484C Applications

  • Telecommunications: Utilized in switching and signal processing applications, this FPGA can manage multiple data streams and interfaces efficiently, ensuring reliable communications infrastructure.
  • Automotive: Ideal for automotive applications such as driver assistance systems, where rapid data processing and reliable operation are critical.
  • Consumer Electronics: Used in devices like high-definition multimedia interfaces and gaming consoles, providing the necessary processing power for enhanced user experiences.
  • Industrial: Applied in control systems and robotics, the XC3S700A-4FGG484C helps to optimize operations and improve efficiency in complex industrial environments.
  • Medical Devices: In medical imaging systems, this FPGA facilitates the processing and analysis of complex images, assisting in faster and more accurate diagnostics.
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