XC3S5000-5FGG900C
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- Mfr.Part #
- XC3S5000-5FGG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 1,948
- In Stock ：
- 1,948
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 31mm
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 2.6mm
- Number of Pins :
- 900
- Qualification Status :
- Not Qualified
- Number of Gates :
- 5000000
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 900
- JESD-609 Code :
- e1
- Number of LABs/CLBs :
- 8320
- Speed Grade :
- 5
- RAM Size :
- 234kB
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 633
- Width :
- 31mm
- Package / Case :
- 900-BBGA
- Series :
- Spartan®-3
- Operating Temperature :
- 0°C~85°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 74880
- ECCN Code :
- 3A991.D
- Pbfree Code :
- yes
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1.2V
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Number of Outputs :
- 633
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 1916928
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 250
- Pin Count :
- 900
- Base Part Number :
- XC3S5000
- Published :
- 2009
- Datasheets
- XC3S5000-5FGG900C
FPGAs AMD Xilinx XC3S5000-5FGG900C Overview
The AMD Xilinx XC3S5000-5FGG900C FPGA is a highly capable component within the field programmable gate array (FPGA) category, engineered to meet the sophisticated demands of modern digital circuits. This device integrates seamlessly into a variety of applications due to its versatile 633 I/O pins packaged neatly in a 900FBGA layout, facilitating robust design flexibility and high-speed interfacing. This FPGA is designed for designers looking for a mix of high-performance logic integration with a reasonable power footprint, making it ideal for both complex algorithms and high-volume data processing tasks.
XC3S5000-5FGG900C Features
The XC3S5000-5FGG900C from AMD Xilinx offers significant advantages for high-demand systems. Key features include its extensive 633 I/O capabilities, which are essential for complex PCB designs requiring numerous connections. The 900FBGA package ensures that despite its vast functionality, the FPGA remains compact and efficient in thermal management. This product's architecture allows for scalable configurations, making it a flexible choice for projects that may need to adapt over time with evolving technological requirements.
XC3S5000-5FGG900C Applications
- Telecommunications Infrastructure: Utilized in routers and switches, the XC3S5000-5FGG900C enhances data throughput and reliability in network backbone devices.
- Automotive Driver Assistance Systems: This FPGA can process multiple inputs from automotive sensors faster, improving the response times and reliability of safety features in smart vehicles.
- Industrial Automation: In industrial control systems, the XC3S5000-5FGG900C manages multiple control loops simultaneously, ensuring high precision and efficiency in automated environments.
- Data Centers: Supports high-speed data processing and storage solutions, facilitating improved data handling and bandwidth management in server farms.
- Consumer Electronics: Ideal for high-definition video processing and complex digital signal management in devices such as high-end televisions and gaming consoles.
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