XC3S5000-4FG676I
- Mfr.Part #
- XC3S5000-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FCBGA
- Stock
- 594
- In Stock :
- 594
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Supplies :
- 1.21.2/3.32.5V
- Height Seated (Max) :
- 2.6mm
- Operating Temperature :
- -40°C~100°C TJ
- RAM Size :
- 234kB
- Factory Lead Time :
- 10 Weeks
- Pbfree Code :
- No
- Width :
- 27mm
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Reach Compliance Code :
- not_compliant
- Published :
- 2009
- JESD-609 Code :
- e0
- Terminal Position :
- BOTTOM
- Length :
- 27mm
- RoHS Status :
- Non-RoHS Compliant
- JESD-30 Code :
- S-PBGA-B676
- Number of Outputs :
- 489
- Package / Case :
- 676-BBGA, FCBGA
- Operating Supply Voltage :
- 1.2V
- Terminal Pitch :
- 1mm
- Surface Mount :
- yes
- Series :
- Spartan®-3
- Speed Grade :
- 4
- Number of LABs/CLBs :
- 8320
- Number of Terminations :
- 676
- Number of Inputs :
- 489
- Peak Reflow Temperature (Cel) :
- 225
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 74880
- Total RAM Bits :
- 1916928
- Voltage - Supply :
- 1.14V~1.26V
- Clock Frequency :
- 630MHz
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of Gates :
- 5000000
- Packaging :
- Bulk
- Pin Count :
- 676
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 489
- Qualification Status :
- Not Qualified
- ECCN Code :
- 3A991.D
- Datasheets
- XC3S5000-4FG676I

FPGAs AMD Xilinx XC3S5000-4FG676I Overview
The FPGAs AMD Xilinx XC3S5000-4FG676I is a highly capable field-programmable gate array designed for applications requiring a high degree of versatility and computational power. As part of AMD Xilinx's renowned Spartan series, this device integrates advanced features into a compact 676-pin flip-chip ball grid array (FCBGA) package, making it an ideal solution for high-performance systems that are space-constrained. This FPGA is engineered to deliver exceptional performance with low power consumption, providing a robust platform for developing complex digital circuits in a customizable manner. The XC3S5000-4FG676I is perfectly suited for designers looking to leverage the scalability and flexibility of FPGAs to push the boundaries of what's possible in digital design.
XC3S5000-4FG676I Features
This FPGA unit boasts 489 I/O pins, providing ample connectivity for various digital components and peripherals. This extensive I/O capability is complemented by a high-density logic configuration that supports sophisticated digital processing tasks and data management in real-time applications. The XC3S5000-4FG676I also features advanced clock management technologies, including multiple phase-locked loops (PLLs), making it exceptionally well-suited for applications requiring precise timing and control.
XC3S5000-4FG676I Applications
- Telecommunications: In devices like routers and switches, this FPGA can manage multiple data streams simultaneously, optimizing bandwidth and reducing latency.
- Automotive Systems: Utilized in driver assistance systems to process real-time sensor data, enhancing vehicle safety and performance.
- Consumer Electronics: Ideal for high-definition video processing in devices such as digital cameras and home entertainment systems.
- Industrial Automation: Helps in managing complex control systems in manufacturing processes, improving efficiency and reliability.
- Aerospace and Defense: Suitable for applications requiring robust, fail-safe electronics, such as satellite communications and avionics.
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