XC3S5000-4FG676I

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Mfr.Part #
XC3S5000-4FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
594
In Stock :
594

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
30
Power Supplies :
1.21.2/3.32.5V
Height Seated (Max) :
2.6mm
Operating Temperature :
-40°C~100°C TJ
RAM Size :
234kB
Factory Lead Time :
10 Weeks
Pbfree Code :
No
Width :
27mm
Supply Voltage :
1.2V
Terminal Form :
Ball
Reach Compliance Code :
not_compliant
Published :
2009
JESD-609 Code :
e0
Terminal Position :
BOTTOM
Length :
27mm
RoHS Status :
Non-RoHS Compliant
JESD-30 Code :
S-PBGA-B676
Number of Outputs :
489
Package / Case :
676-BBGA, FCBGA
Operating Supply Voltage :
1.2V
Terminal Pitch :
1mm
Surface Mount :
yes
Series :
Spartan®-3
Speed Grade :
4
Number of LABs/CLBs :
8320
Number of Terminations :
676
Number of Inputs :
489
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
74880
Total RAM Bits :
1916928
Voltage - Supply :
1.14V~1.26V
Clock Frequency :
630MHz
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mounting Type :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.61 ns
Number of Gates :
5000000
Packaging :
Bulk
Pin Count :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
489
Qualification Status :
Not Qualified
ECCN Code :
3A991.D
Datasheets
XC3S5000-4FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, Mounting Type:Surface Mount, XC3S5000-4FG676I pinout, XC3S5000-4FG676I datasheet PDF, XC3S5000-4FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FG676I


FPGAs AMD Xilinx XC3S5000-4FG676I Overview

The FPGAs AMD Xilinx XC3S5000-4FG676I is a highly capable field-programmable gate array designed for applications requiring a high degree of versatility and computational power. As part of AMD Xilinx's renowned Spartan series, this device integrates advanced features into a compact 676-pin flip-chip ball grid array (FCBGA) package, making it an ideal solution for high-performance systems that are space-constrained. This FPGA is engineered to deliver exceptional performance with low power consumption, providing a robust platform for developing complex digital circuits in a customizable manner. The XC3S5000-4FG676I is perfectly suited for designers looking to leverage the scalability and flexibility of FPGAs to push the boundaries of what's possible in digital design.

XC3S5000-4FG676I Features

This FPGA unit boasts 489 I/O pins, providing ample connectivity for various digital components and peripherals. This extensive I/O capability is complemented by a high-density logic configuration that supports sophisticated digital processing tasks and data management in real-time applications. The XC3S5000-4FG676I also features advanced clock management technologies, including multiple phase-locked loops (PLLs), making it exceptionally well-suited for applications requiring precise timing and control.

XC3S5000-4FG676I Applications

  • Telecommunications: In devices like routers and switches, this FPGA can manage multiple data streams simultaneously, optimizing bandwidth and reducing latency.
  • Automotive Systems: Utilized in driver assistance systems to process real-time sensor data, enhancing vehicle safety and performance.
  • Consumer Electronics: Ideal for high-definition video processing in devices such as digital cameras and home entertainment systems.
  • Industrial Automation: Helps in managing complex control systems in manufacturing processes, improving efficiency and reliability.
  • Aerospace and Defense: Suitable for applications requiring robust, fail-safe electronics, such as satellite communications and avionics.
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