XC3S5000-4FG676I

Share

Or copy the link below:

Mfr.Part #
XC3S5000-4FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
594
In Stock :
594

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2009
Terminal Pitch :
1mm
Reach Compliance Code :
not_compliant
Operating Supply Voltage :
1.2V
Length :
27mm
Pin Count :
676
Speed Grade :
4
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Number of Inputs :
489
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
Ball
Height Seated (Max) :
2.6mm
Width :
27mm
Total RAM Bits :
1916928
Supply Voltage :
1.2V
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
676
Factory Lead Time :
10 Weeks
Number of Gates :
5000000
Terminal Position :
BOTTOM
Power Supplies :
1.21.2/3.32.5V
RAM Size :
234kB
Number of I/O :
489
Package / Case :
676-BBGA, FCBGA
Terminal Finish :
Tin/Lead (Sn63Pb37)
ECCN Code :
3A991.D
Series :
Spartan®-3
Qualification Status :
Not Qualified
Number of Outputs :
489
Packaging :
Bulk
Peak Reflow Temperature (Cel) :
225
Number of LABs/CLBs :
8320
JESD-609 Code :
e0
Clock Frequency :
630MHz
Surface Mount :
yes
Combinatorial Delay of a CLB-Max :
0.61 ns
Pbfree Code :
No
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B676
Voltage - Supply :
1.14V~1.26V
Number of Logic Elements/Cells :
74880
Datasheets
XC3S5000-4FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, XC3S5000-4FG676I pinout, XC3S5000-4FG676I datasheet PDF, XC3S5000-4FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FG676I


FPGAs AMD Xilinx XC3S5000-4FG676I Overview

The FPGAs AMD Xilinx XC3S5000-4FG676I is a highly capable field-programmable gate array designed for applications requiring a high degree of versatility and computational power. As part of AMD Xilinx's renowned Spartan series, this device integrates advanced features into a compact 676-pin flip-chip ball grid array (FCBGA) package, making it an ideal solution for high-performance systems that are space-constrained. This FPGA is engineered to deliver exceptional performance with low power consumption, providing a robust platform for developing complex digital circuits in a customizable manner. The XC3S5000-4FG676I is perfectly suited for designers looking to leverage the scalability and flexibility of FPGAs to push the boundaries of what's possible in digital design.

XC3S5000-4FG676I Features

This FPGA unit boasts 489 I/O pins, providing ample connectivity for various digital components and peripherals. This extensive I/O capability is complemented by a high-density logic configuration that supports sophisticated digital processing tasks and data management in real-time applications. The XC3S5000-4FG676I also features advanced clock management technologies, including multiple phase-locked loops (PLLs), making it exceptionally well-suited for applications requiring precise timing and control.

XC3S5000-4FG676I Applications

  • Telecommunications: In devices like routers and switches, this FPGA can manage multiple data streams simultaneously, optimizing bandwidth and reducing latency.
  • Automotive Systems: Utilized in driver assistance systems to process real-time sensor data, enhancing vehicle safety and performance.
  • Consumer Electronics: Ideal for high-definition video processing in devices such as digital cameras and home entertainment systems.
  • Industrial Automation: Helps in managing complex control systems in manufacturing processes, improving efficiency and reliability.
  • Aerospace and Defense: Suitable for applications requiring robust, fail-safe electronics, such as satellite communications and avionics.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

Manufacturer related products

Catalog related products

RFQ
BOM