XC3S200AN-4FT256I
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- Mfr.Part #
- XC3S200AN-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 195 I/O 256FTBGA
- Stock
- 117
- In Stock ：
- 117
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pbfree Code :
- No
- Peak Reflow Temperature (Cel) :
- 240
- Number of Gates :
- 200000
- Pin Count :
- 256
- Terminal Form :
- Ball
- Packaging :
- Tray
- Reach Compliance Code :
- not_compliant
- Number of Outputs :
- 160
- Clock Frequency :
- 667MHz
- Published :
- 2008
- Power Supplies :
- 1.21.2/3.33.3V
- Mount :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Speed Grade :
- 4
- Width :
- 17mm
- Height Seated (Max) :
- 1.55mm
- JESD-609 Code :
- e0
- Factory Lead Time :
- 10 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Supply Voltage :
- 1.2V
- Package / Case :
- 256-LBGA
- Total RAM Bits :
- 294912
- Number of Pins :
- 256
- Series :
- Spartan®-3AN
- Voltage - Supply :
- 1.14V~1.26V
- Number of Terminations :
- 256
- RAM Size :
- 36KB
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC3S200AN
- ECCN Code :
- EAR99
- Number of I/O :
- 195
- Number of CLBs :
- 448
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 448
- Number of Logic Elements/Cells :
- 4032
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Length :
- 17mm
- Datasheets
- XC3S200AN-4FT256I
FPGAs AMD Xilinx XC3S200AN-4FT256I Overview
The AMD Xilinx XC3S200AN-4FT256I FPGA stands out in the realm of programmable logic solutions, offering robust versatility and performance for a wide range of applications. This integrated circuit is designed to meet the demanding requirements of modern digital systems, with a high level of integration and capabilities to handle complex algorithms and processes. The XC3S200AN-4FT256I, housed in a 256FTBGA package, provides a substantial number of I/O options with 195 available, making it an excellent choice for designers seeking flexibility and scalability in their systems. Its ability to be reprogrammed on the fly adds immense value in rapidly evolving technological landscapes, catering efficiently to both prototyping and mass production needs.
XC3S200AN-4FT256I Features
This FPGA is equipped with a host of features that enhance its functionality and utility in various applications. The device includes 195 I/O pins, which are crucial for multifaceted interfacing with other components in complex systems. The 256FTBGA packaging not only ensures a compact form factor but also aids in better thermal management and reduced signal integrity issues, enhancing the overall reliability and performance of the product.
XC3S200AN-4FT256I Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and home entertainment systems, the XC3S200AN-4FT256I enhances functionality by handling multiple tasks simultaneously and efficiently.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS), this FPGA improves response times and reliability, crucial for safety-critical applications in vehicles.
- Industrial Automation: In automation and control systems, the XC3S200AN-4FT256I manages complex algorithms that facilitate real-time operations and monitoring, thus increasing the efficiency and reliability of industrial processes.
- Telecommunications: Supports high-speed data processing and transmission required in networking equipment, improving bandwidth and reducing latency in communications infrastructures.
- Medical Devices: Used in medical imaging systems, the FPGA processes large volumes of data rapidly, ensuring that high-resolution imaging is both fast and accurate, essential for effective diagnosis and treatment.
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