XC3S2000-4FGG900C
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- Mfr.Part #
- XC3S2000-4FGG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 565 I/O 900FBGA
- Stock
- 2,228
- In Stock ：
- 2,228
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 46080
- Package / Case :
- 900-BBGA
- Power Supplies :
- 1.21.2/3.32.5V
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 2.6mm
- Terminal Pitch :
- 1mm
- Published :
- 2009
- RAM Size :
- 90kB
- Number of Gates :
- 2000000
- Base Part Number :
- XC3S2000
- Voltage - Supply :
- 1.14V~1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of Outputs :
- 565
- Number of LABs/CLBs :
- 5120
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- ECCN Code :
- 3A991.D
- Peak Reflow Temperature (Cel) :
- 250
- Total RAM Bits :
- 737280
- Width :
- 31mm
- Length :
- 31mm
- JESD-609 Code :
- e1
- Pin Count :
- 900
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 900
- Speed Grade :
- 4
- Number of Pins :
- 900
- Pbfree Code :
- yes
- Number of I/O :
- 565
- Packaging :
- Tray
- Supply Voltage :
- 1.2V
- Series :
- Spartan®-3
- Clock Frequency :
- 630MHz
- Factory Lead Time :
- 10 Weeks
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC3S2000-4FGG900C
FPGAs AMD Xilinx XC3S2000-4FGG900C Overview
Introducing the advanced FPGAs AMD Xilinx XC3S2000-4FGG900C, a high-performance Field Programmable Gate Array (FPGA) designed to meet the complex and demanding needs of modern digital circuits. Manufactured by AMD Xilinx, this FPGA features a dense architecture encapsulated in a 900FBGA package, offering exceptional integration capabilities with 565 I/O options for versatile connectivity. This product is crafted to deliver optimized performance for applications requiring high-speed data processing and significant logic density, making it an ideal solution for designers seeking robust, scalable hardware platforms.
XC3S2000-4FGG900C Features
The XC3S2000-4FGG900C FPGA is equipped with numerous features that make it stand out in the realm of digital circuit design. It is housed in a 900FBGA package, ensuring a compact form factor while supporting a wide array of inputs and outputs. The device facilitates complex digital interactions and supports a multitude of logic operations, crucial for high-performance computing tasks. Its robust I/O capability ensures flexibility in integrating various peripheral devices, enhancing system functionality and reliability.
XC3S2000-4FGG900C Applications
- Telecommunications Equipment: Integrates into routing and switching systems to enhance signal integrity and processing speed, contributing to more efficient network management and reliability.
- Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, aiding in real-time decision making and vehicle automation.
- Consumer Electronics: Forms the core of sophisticated home entertainment systems, enabling complex video processing and connectivity for a seamless user experience.
- Industrial Automation: Powers control systems in manufacturing environments, allowing for precise operation and monitoring of industrial machinery and process automation.
- Aerospace and Defense: Critical for navigation and control systems in aerospace applications, providing the necessary computational power and reliability demanded in harsh environments.
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