XC2VP30-5FGG676I

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Mfr.Part #
XC2VP30-5FGG676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 416 I/O 676FBGA
Stock
47,328
In Stock :
47,328

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
27mm
Published :
2001
Height Seated (Max) :
2.44mm
Speed Grade :
5
Number of I/O :
416
Number of Registers :
27392
Time@Peak Reflow Temperature-Max (s) :
30
Peak Reflow Temperature (Cel) :
250
Combinatorial Delay of a CLB-Max :
0.36 ns
Factory Lead Time :
6 Weeks
Number of Logic Elements/Cells :
30816
Package / Case :
676-BGA
Pin Count :
676
Terminal Position :
BOTTOM
Mount :
Surface Mount
Pbfree Code :
yes
Number of Pins :
676
Series :
Virtex®-II Pro
Terminal Form :
Ball
Terminal Pitch :
1mm
Total RAM Bits :
2506752
Qualification Status :
Not Qualified
Number of Terminations :
676
RoHS Status :
ROHS3 Compliant
Supply Voltage :
1.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
JESD-609 Code :
e1
Operating Temperature :
-40°C~100°C TJ
ECCN Code :
3A991.D
Length :
27mm
Number of LABs/CLBs :
3424
Mounting Type :
Surface Mount
RAM Size :
306kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Supply Voltage :
1.5V
Base Part Number :
XC2VP30
Voltage - Supply :
1.425V~1.575V
Number of Outputs :
416
Datasheets
XC2VP30-5FGG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BGA, Number of Pins:676, Number of Terminations:676, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Base Part Number:XC2VP30, XC2VP30-5FGG676I pinout, XC2VP30-5FGG676I datasheet PDF, XC2VP30-5FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC2VP30-5FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC2VP30-5FGG676I


FPGAs AMD Xilinx XC2VP30-5FGG676I Overview

The FPGAs AMD Xilinx XC2VP30-5FGG676I is a highly capable and versatile field-programmable gate array designed to meet the needs of advanced digital circuits. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA is ideal for designers aiming to leverage speed and functionality with high-density logic integration. Encased in a 676-pin Fine Ball Grid Array (FBGA) package, the XC2VP30-5FGG676I supports a wide array of digital and mixed-signal applications. This component integrates seamlessly into various system designs, offering a robust platform for developing complex hardware solutions in a compact footprint. Its utility in high-performance environments makes it a prime choice for businesses seeking to enhance technological capabilities while ensuring system reliability.

XC2VP30-5FGG676I Features

This FPGA model boasts 416 I/O pins, providing extensive connectivity and interface options. These features facilitate flexible and scalable designs, allowing system architects to push the boundaries of what's possible within digital circuitry. The large number of I/O pins ensures that it can handle multiple inputs and outputs, making it suitable for intricate parallel processing tasks and high-speed digital interfacing. The robust packaging of the 676FBGA also ensures durable and reliable operation, even in challenging physical and operational environments.

XC2VP30-5FGG676I Applications

  • Telecommunications: Utilized in communication infrastructure, the XC2VP30-5FGG676I aids in the processing and routing of high-speed data, enhancing bandwidth and signal integrity.
  • Automotive systems: Integrates into driver assistance systems where real-time processing is critical, enhancing vehicle safety and functionality.
  • Industrial automation: Helps to control machinery and processes, improving efficiency and precision in complex automation systems.
  • Consumer electronics: Key in developing interactive and multimedia features for consumer devices, offering enhanced user experiences through high-speed signal processing.
  • Medical devices: Supports critical medical systems, such as imaging and diagnostic equipment, ensuring fast and accurate data processing for healthcare applications.
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