XC2VP30-5FG676I
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- Mfr.Part #
- XC2VP30-5FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 676FCBGA
- Stock
- 570
- In Stock ：
- 570
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pin Count :
- 676
- Number of LABs/CLBs :
- 3424
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.5V
- Packaging :
- Tray
- Operating Supply Voltage :
- 1.5V
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 676
- Series :
- Virtex®-II Pro
- Number of Logic Elements/Cells :
- 30816
- Speed Grade :
- 5
- Qualification Status :
- Not Qualified
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 27mm
- Number of Outputs :
- 416
- Peak Reflow Temperature (Cel) :
- 225
- Operating Temperature :
- -40°C~100°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Combinatorial Delay of a CLB-Max :
- 0.36 ns
- RAM Size :
- 306kB
- Base Part Number :
- XC2VP30
- Total RAM Bits :
- 2506752
- Number of Registers :
- 27392
- Number of I/O :
- 416
- Mounting Type :
- Surface Mount
- Package / Case :
- 676-BBGA, FCBGA
- Height Seated (Max) :
- 2.44mm
- Published :
- 2011
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 1.425V~1.575V
- Factory Lead Time :
- 6 Weeks
- Number of Terminations :
- 676
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- Datasheets
- XC2VP30-5FG676I
FPGAs AMD Xilinx XC2VP30-5FG676I Overview
The FPGAs AMD Xilinx XC2VP30-5FG676I is a highly capable field-programmable gate array (FPGA) designed to meet the demanding needs of modern digital circuits. This product from AMD Xilinx offers a versatile platform for the development of high-speed, complex digital systems. The XC2VP30-5FG676I is built on a robust architecture that supports a wide range of applications, making it an ideal choice for designers looking for a flexible and powerful solution. Its 676-pin flip-chip ball grid array (FCBGA) packaging ensures a compact form factor while providing ample I/O options with 416 input/output pins, making it perfect for space-constrained yet performance-demanding applications.
XC2VP30-5FG676I Features
This FPGA model boasts an array of features that enhance its functionality and adaptability in various environments. Key features include a large number of I/O pins which facilitate easier connection and communication with other components in a system. Its high integration capability enables designers to include more functions within a single chip, reducing the overall system complexity and increasing reliability. The XC2VP30-5FG676I also supports multiple configuration options, allowing for greater flexibility in its application and deployment in different technological setups.
XC2VP30-5FG676I Applications
- Telecommunications: The high-speed data processing and significant I/O capabilities make it ideal for telecommunications infrastructure, including routers and switches, where fast data throughput and reliability are paramount.
- Automotive: Used in advanced driver-assistance systems (ADAS), where its ability to rapidly process inputs from various sensors can contribute to safer driving technologies.
- Consumer Electronics: Integral in the development of high-performance consumer electronics, such as smart TVs and gaming consoles, where enhanced graphic and data processing are crucial.
- Industrial: Applies to automation systems, providing the necessary speed and flexibility for controlling complex machinery and processes in real-time.
- Aerospace: Suitable for aerospace applications, where its robust processing capabilities can handle the rigorous computations required for navigation and control systems.
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