XC18V512SO20C

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Mfr.Part #
XC18V512SO20C
Manufacturer
AMD Xilinx
Package / Case
20-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC PROM SRL CONFIG 512K 20-SOIC
Stock
1
In Stock :
1

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Terminal Pitch :
1.27mm
Operating Temperature :
0°C~70°C
Published :
1999
ECCN Code :
EAR99
Voltage - Supply :
3V~3.6V
Peak Reflow Temperature (Cel) :
225
Number of Functions :
1
Parallel/Serial :
Parallel/Serial
Package / Case :
20-SOIC (0.295, 7.50mm Width)
Programmable Type :
In System Programmable
Supply Voltage-Max (Vsup) :
3.6V
Memory Width :
8
Number of Terminations :
20
Supply Current-Max :
0.025mA
RoHS Status :
Non-RoHS Compliant
Radiation Hardening :
No
JESD-609 Code :
e0
Supply Voltage :
3.3V
Terminal Finish :
Tin/Lead (Sn85Pb15)
Operating Supply Voltage :
3.3V
Access Time (Max) :
15 ns
Supply Voltage-Min (Vsup) :
3V
Number of Pins :
20
Standby Current-Max :
0.01A
Data Retention Time-Min :
20
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Surface Mount
Lead Free :
Contains Lead
Packaging :
Tube
Terminal Position :
Dual
Pbfree Code :
No
Clock Frequency :
33MHz
Surface Mount :
yes
Factory Lead Time :
10 Weeks
Pin Count :
20
Memory IC Type :
CONFIGURATION MEMORY
Density :
512 kb
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Gull wing
Height Seated (Max) :
2.6416mm
Width :
7.5184mm
Base Part Number :
XC18V512
Length :
12.827mm
Organization :
64KX8
Datasheets
XC18V512SO20C
Introducing Configuration Proms for FPGAs AMD Xilinx XC18V512SO20C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C, Package / Case:20-SOIC (0.295, 7.50mm Width), Number of Terminations:20, Number of Pins:20, Mounting Type:Surface Mount, Base Part Number:XC18V512, XC18V512SO20C pinout, XC18V512SO20C datasheet PDF, XC18V512SO20C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC18V512SO20C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC18V512SO20C


Configuration Proms for FPGAs by AMD Xilinx - XC18V512SO20C Overview

Introducing the XC18V512SO20C, a cutting-edge Integrated Circuit Programmable Read-Only Memory (PROM) meticulously crafted by AMD Xilinx. This sophisticated device represents the pinnacle of reliability and efficiency in configuring Field-Programmable Gate Arrays (FPGAs). Designed with precision and engineered with excellence, it embodies the fusion of advanced technology and unparalleled performance.

At the heart of its design lies a formidable 512K memory capacity, housed within a compact 20SOIC package, ensuring seamless integration and optimal space utilization. Its Serial configuration offers swift and effortless programming, facilitating rapid deployment and enhancing operational agility.

Whether in aerospace, telecommunications, automotive, or industrial automation, the XC18V512SO20C stands as a beacon of innovation, empowering businesses to realize their boldest aspirations with unparalleled ease and efficiency.

XC18V512SO20C Features

  • 512K memory capacity for extensive configuration needs
  • 20SOIC package for compact and efficient integration
  • Serial configuration for swift and hassle-free programming
  • PROM architecture ensuring reliability and durability
  • Advanced technology for optimal performance

XC18V512SO20C Applications

  • Automotive Electronics: Utilized in Engine Control Units (ECUs) and Advanced Driver Assistance Systems (ADAS) for efficient FPGA configuration, enhancing vehicle performance and safety.
  • Telecommunications Infrastructure: Integrated into base stations and network equipment for rapid configuration of FPGAs, enabling seamless connectivity and network optimization.
  • Aerospace Systems: Deployed in avionics and flight control systems to configure FPGAs, ensuring reliability and precision in critical aerospace operations.
  • Industrial Automation: Employed in Programmable Logic Controllers (PLCs) and robotic systems for flexible FPGA configuration, enhancing productivity and operational efficiency in manufacturing environments.
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