XA7Z030-1FBG484I
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- Mfr.Part #
- XA7Z030-1FBG484I
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 484FCBGA
- Stock
- 25,811
- In Stock ：
- 25,811
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Peak Reflow Temperature (Cel) :
- 250
- Published :
- 2010
- Qualification Status :
- Not Qualified
- Operating Temperature :
- -40°C~100°C TJ
- Series :
- Automotive, AEC-Q100, Zynq®-7000 XA
- Width :
- 23mm
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Terminations :
- 484
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 2.54mm
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Speed :
- 667MHz
- JESD-30 Code :
- S-PBGA-B484
- Package / Case :
- 484-BBGA, FCBGA
- RAM Size :
- 256KB
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- UV Erasable :
- N
- Architecture :
- MCU, FPGA
- ECCN Code :
- EAR99
- RoHS Status :
- RoHS Compliant
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Reach Compliance Code :
- not_compliant
- Number of I/O :
- 130
- Peripherals :
- DMA
- Packaging :
- Tray
- Length :
- 23mm
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- Power Supplies :
- 11.8V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.39.00.01
- Datasheets
- XA7Z030-1FBG484I
484 Terminations -40°C~100°C TJ System On Chip Automotive, AEC-Q100, Zynq®-7000 XA Series 130 I/O
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Automotive, AEC-Q100, Zynq®-7000 XA series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.The system on a chip uses 484 terminations in total.This system on chip SoC requires 11.8V power supply at all.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XA7Z030-1FBG484I System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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