XA7S75-2FGGA676I

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Mfr.Part #
XA7S75-2FGGA676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FBGA
Stock
20,435
In Stock :
20,435

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.95V~1.05V
Operating Temperature :
-40°C~100°C TJ
Mounting Type :
Surface Mount
Factory Lead Time :
10 Weeks
Package / Case :
676-BGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Automotive, AEC-Q100, Spartan®-7 XA
Number of LABs/CLBs :
6000
Number of I/O :
400
Number of Logic Elements/Cells :
76800
Total RAM Bits :
3317760
Datasheets
XA7S75-2FGGA676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XA7S75-2FGGA676I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:676-BGA, XA7S75-2FGGA676I pinout, XA7S75-2FGGA676I datasheet PDF, XA7S75-2FGGA676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XA7S75-2FGGA676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XA7S75-2FGGA676I


FPGAs AMD Xilinx XA7S75-2FGGA676I Overview

The FPGAs AMD Xilinx XA7S75-2FGGA676I is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding needs of modern digital circuits. Crafted by AMD Xilinx, a leader in integrated circuits technology, this FPGA is tailored for robust utility in complex electronic environments. The XA7S75-2FGGA676I model is integrated into a 676-pin Fine Pitch Ball Grid Array (FBGA) package, ensuring a compact footprint while offering expansive functionality with 400 I/O options. This product is ideal for developers looking to harness the power of a flexible, high-capacity programmable logic device in their applications.

XA7S75-2FGGA676I Features

The XA7S75-2FGGA676I FPGA boasts a versatile set of features designed for superior performance and adaptability:

  • 400 programmable I/O ports, allowing for extensive peripheral and user interface integrations.
  • Embedded in a 676-pin FBGA package, providing robust connectivity in a dense configuration.
  • Highly adaptable logic configuration capabilities, suited to a wide range of applications.
  • Optimized power management for improved energy efficiency.

XA7S75-2FGGA676I Applications

  • Telecommunications Equipment: Utilizes its extensive I/O capabilities to manage data flows and signal processing, enhancing communication systems' performance and reliability.
  • Automotive Electronics: Can be integrated into vehicle systems for controlling and monitoring functions, contributing to advancements in automotive safety and infotainment.
  • Consumer Electronics: Serves as the core processing unit in devices such as high-definition televisions and gaming consoles, where high-speed signal processing is crucial.
  • Industrial Automation: Empowers machinery with smart control systems, enabling more precise operations in manufacturing processes.
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