X28C010NM-12

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Mfr.Part #
X28C010NM-12
Manufacturer
Xicor-Division of Intersil
Package / Case
32-CLCC
Datasheet
Download
Description
IC EEPROM 1MBIT PARALLEL 32CLCC
Stock
127
In Stock :
127

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Manufacturer :
Xicor-Division of Intersil
Product Category :
Memory
Terminal Pitch :
1.27 mm
Manufacturer :
Rochester Electronics LLC
Memory Interface :
Parallel
JESD-30 Code :
R-CQCC-N32
Reach Compliance Code :
Unknown
Memory Density :
1048576 bit
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Memory Organization :
128K x 8
Technology :
EEPROM
Memory IC Type :
EEPROM
Memory Width :
8
Product Status :
Active
Memory Type :
Non-Volatile
Parallel/Serial :
Parallel
Supply Voltage-Max (Vsup) :
5.5 V
Surface Mount :
yes
Memory Size :
1Mbit
Width :
11.43 mm
Mounting Type :
Surface Mount
Number of Functions :
1
Qualification Status :
COMMERCIAL
Access Time :
120 ns
Number of Terminals :
32
Seated Height-Max :
3.05 mm
Pin Count :
32
Number of Words :
131072 words
Organization :
128KX8
Package / Case :
32-CLCC
RoHS :
Non-Compliant
Base Product Number :
X28C010
Series :
-
Supplier Device Package :
32-CLCC (11.43x13.97)
Operating Temperature :
-55°C ~ 125°C
Package :
Bulk
Terminal Finish :
TIN LEAD
JESD-609 Code :
e0
Temperature Grade :
Military
Write Cycle Time-Max (tWC) :
10 ms
Length :
13.97 mm
Operating Mode :
ASYNCHRONOUS
Write Cycle Time - Word, Page :
10ms
Voltage - Supply :
4.5V ~ 5.5V
Supply Voltage-Min (Vsup) :
4.5 V
Programming Voltage :
5 V
Memory Format :
EEPROM
Package Shape :
RECTANGULAR
Pbfree Code :
No
Terminal Form :
NO LEAD
Terminal Position :
QUAD
Datasheets
X28C010NM-12
Introducing Memory Xicor-Division of Intersil X28C010NM-12 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:32-CLCC, Operating Temperature:-55°C ~ 125°C, X28C010NM-12 pinout, X28C010NM-12 datasheet PDF, X28C010NM-12 amp .Beyond Memory Xicor-Division of Intersil X28C010NM-12 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Xicor-Division of Intersil X28C010NM-12


Memory Xicor-Division of Intersil X28C010NM-12 Overview

Introducing the X28C010NM-12, a cutting-edge IC EEPROM designed by Xicor-Division of Intersil. This 1MBIT parallel EEPROM in a 32CLCC package offers unparalleled performance and reliability, making it the ideal choice for demanding industrial applications. With its innovative design and robust construction, this EEPROM sets a new standard for data storage solutions.

X28C010NM-12 Features

  • High capacity: Boasting 1MBIT of storage capacity, the X28C010NM-12 provides ample space for storing critical data.
  • Parallel interface: The parallel interface allows for fast and efficient data transfer, ensuring rapid access to stored information.
  • 32CLCC package: Housed in a compact 32CLCC package, this EEPROM offers space-saving benefits without compromising on performance.
  • Robust construction: Built to withstand harsh industrial environments, the X28C010NM-12 is highly durable and reliable.
  • Wide operating temperature range: With a wide operating temperature range, this EEPROM performs flawlessly in extreme conditions.

X28C010NM-12 Applications

  • Industrial automation: The X28C010NM-12 is ideally suited for use in industrial automation systems, where reliable data storage is essential for optimal performance. Its high capacity and robust construction make it the perfect choice for storing critical process data and configuration parameters.
  • Embedded systems: In embedded systems such as microcontrollers and single-board computers, the X28C010NM-12 provides reliable non-volatile storage for boot code, firmware, and configuration settings. Its parallel interface ensures fast access to stored data, enhancing overall system performance.
  • Telecommunications equipment: The X28C010NM-12 finds application in telecommunications equipment, where it serves as a dependable storage solution for call logs, subscriber information, and system configuration data. Its compact form factor and wide operating temperature range make it suitable for use in telecommunications infrastructure deployed in diverse environments.
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