WB3M200VD1T

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Mfr.Part #
WB3M200VD1T
Manufacturer
JAE Electronics
Package / Case
Datasheet
Download
Description
CONN PLUG 200POS SMD GOLD
Stock
22,030
In Stock :
22,030

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Manufacturer :
JAE Electronics
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
Number of Positions :
200
RoHS Status :
RoHS Compliant
Contact Plating :
Gold
Termination :
SMD/SMT
Number of Rows :
2
Housing Color :
Black
Height Above Board :
0.185 4.70mm
Series :
WB3
Feature :
Board Guide, Solder Retention
Min Operating Temperature :
-40°C
Contact Finish Thickness :
30.0μin 0.76μm
Mounting Type :
Surface Mount
Flammability Rating :
UL94 V-0
Lead Free :
Lead Free
Height :
4.7mm
Length :
56.7mm
Mount :
Surface Mount
Contact Finish :
Gold
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Housing Material :
Thermoplastic
Current Rating :
500mA
Width :
7.1mm
Pitch :
0.020 0.50mm
Published :
2004
Max Operating Temperature :
85°C
Stack Height (Mating) :
5mm
Connector Type :
Plug, Outer Shroud Contacts
Packaging :
Tray
Datasheets
WB3M200VD1T
Introducing Arrays, Edge Type, Mezzanine (Board to Board) JAE Electronics WB3M200VD1T from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, WB3M200VD1T pinout, WB3M200VD1T datasheet PDF, WB3M200VD1T amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) JAE Electronics WB3M200VD1T ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.

JAE Electronics WB3M200VD1T


Plug, Outer Shroud Contacts Tray 2 Rows 0.020 0.50mm Surface Mount 200 Positions WB3 Gold SMD/SMT

WB3M200VD1T Description


WB3M200VD1T is a board-to-board connector compatible with PCI express. WB3M200VD1T is a board-to-board connector satisfying the specification of the transmission characteristics of PCI Express standard. The connector is suitable for connections between units that need TMDS transmissions, such as graphic cards and PCI Express. The Operating and Storage Temperature Range is between -40 and 85℃. And the transistor WB3M200VD1T is in the tray package.



WB3M200VD1T Features


Compliant with PCI Express Card Electrical Mechanical SPEC

High density 0.5mm pitch type yet having a high-level transmission characteristic and high-speed transmission is possible.

Contact configuration that enables transmission of PCI Express(X16), TMDS, VGA, and others.

IParallel board-to-board connection is possible. Stacking heights, 4mm, and 5mm are available.

IEMI shielding is applied.

Compatible with automatic mounting. 

Available in embossed tape package.



WB3M200VD1T Applications


Automotive 

Body electronics & lighting 

Communications equipment 

Datacom module 

Personal electronics 

Connected peripherals & printers


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