W979H6KBVX2I

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Mfr.Part #
W979H6KBVX2I
Manufacturer
Winbond Electronics Corporation
Package / Case
134-VFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PAR 134VFBGA
Stock
39,253
In Stock :
39,253

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Manufacturer :
Winbond Electronics Corporation
Product Category :
Memory
Factory Lead Time :
10 Weeks
Height Seated (Max) :
1mm
Access Mode :
FOUR BANK PAGE BURST
Surface Mount :
yes
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.14V
Length :
11.5mm
Memory Interface :
Parallel
Operating Mode :
SYNCHRONOUS
Write Cycle Time - Word, Page :
15ns
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Max (Vsup) :
1.3V
Supply Voltage :
1.2V
Package / Case :
134-VFBGA
Number of Ports :
1
Mounting Type :
Surface Mount
Clock Frequency :
400MHz
Memory Density :
536870912 bit
Packaging :
Tray
Published :
2016
Terminal Position :
BOTTOM
Organization :
32MX16
Memory Size :
512Mb 32M x 16
Number of Terminations :
134
Memory Type :
Volatile
Memory Width :
16
RoHS Status :
ROHS3 Compliant
Width :
10mm
Number of Pins :
134
Memory Format :
DRAM
Additional Feature :
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Voltage - Supply :
1.14V~1.95V
Terminal Pitch :
0.65mm
Datasheets
W979H6KBVX2I
Introducing Memory Winbond Electronics Corporation W979H6KBVX2I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:134-VFBGA, Mounting Type:Surface Mount, Number of Terminations:134, Number of Pins:134, W979H6KBVX2I pinout, W979H6KBVX2I datasheet PDF, W979H6KBVX2I amp .Beyond Memory Winbond Electronics Corporation W979H6KBVX2I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Winbond Electronics Corporation W979H6KBVX2I


Memory Winbond Electronics Corporation W979H6KBVX2I Overview

Introducing the W979H6KBVX2I from Winbond Electronics Corporation, a state-of-the-art DRAM chip that exemplifies cutting-edge memory technology. This 512Mbit DRAM, encapsulated in a compact 134-ball VFBGA package, offers robust parallel processing capabilities that are essential for high-performance computing systems. Designed to support a wide range of industrial applications, the W979H6KBVX2I excels in environments requiring high-speed data processing and substantial storage capacity. This Memory Winbond Electronics Corporation W979H6KBVX2I component is ideal for manufacturers aiming to enhance their products with reliable and efficient memory solutions.

W979H6KBVX2I Features

The W979H6KBVX2I DRAM chip boasts a range of impressive features designed to meet the demanding needs of modern electronics. Key features include a high storage capacity of 512Mbit and a versatile 134-ball VFBGA packaging, making it perfect for dense circuit designs. With its parallel interface, this DRAM facilitates faster data transfer rates, enhancing overall system responsiveness and efficiency.

W979H6KBVX2I Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets, the W979H6KBVX2I enhances multitasking capabilities and supports advanced user interfaces.
  • Automotive Systems: Critical for automotive infotainment systems, this DRAM ensures smooth processing of real-time data and improves the interface responsiveness.
  • Networking Equipment: In routers and switches, the W979H6KBVX2I manages multiple data streams, improving bandwidth efficiency and network performance.
  • Industrial Automation: This DRAM is integral in automation systems for its ability to handle complex computations and support robust, real-time control systems.
  • Computing: Essential for PCs and servers, it ensures efficient processing of large datasets, enhancing both speed and performance in intensive computing environments.
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Shipping Method

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Shipping Cost

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