W25X64VSFIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

HTS Code :

8542.32.00.51

Packaging :

Tube

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2.64mm

JESD-609 Code :

e3

Standby Current-Max :

0.00001A

Endurance :

100000 Write/Erase Cycles

Time@Peak Reflow Temperature-Max (s) :

40

Pin Count :

16

Nominal Supply Current :

18mA

Write Cycle Time - Word, Page :

3ms

Density :

64 Mb

Memory Size :

64Mb 8M x 8

Voltage - Supply :

2.7V~3.6V

Memory Interface :

SPI

Address Bus Width :

23b

Length :

10.285mm

Supply Voltage-Max (Vsup) :

3.6V

Interface :

SPI, Serial

ECCN Code :

3A991.B.1.A

Number of Functions :

1

Terminal Finish :

Matte Tin (Sn)

Sync/Async :

SYNCHRONOUS

Radiation Hardening :

No

Supply Voltage-Min (Vsup) :

2.7V

RoHS Status :

ROHS3 Compliant

Write Protection :

HARDWARE/SOFTWARE

Published :

2007

Operating Temperature :

-40°C~85°C TA

Series :

SpiFlash®

Organization :

8MX8

Data Retention Time-Min :

20

Access Time :

7 ns

Memory Width :

8

Number of Terminations :

16

Peak Reflow Temperature (Cel) :

260

Operating Supply Voltage :

3.3V

Memory Format :

Flash

Memory Type :

Non-Volatile

Supply Voltage :

3V

Mounting Type :

Surface Mount

Serial Bus Type :

SPI

Number of Pins :

16

Terminal Pitch :

1.27mm

Word Size :

8B

Clock Frequency :

75MHz

Package / Case :

16-SOIC (0.295, 7.50mm Width)

Mount :

Surface Mount

Terminal Position :

Dual

Programming Voltage :

2.7V