W25Q64BVSFIG
- Mfr.Part #
- W25Q64BVSFIG
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 16-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC FLASH 64MBIT SPI 80MHZ 16SOIC
- Stock
- 6,967
- In Stock :
- 6,967
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Operating Temperature :
- -40°C~85°C TA
- Voltage - Supply :
- 2.7V~3.6V
- Supply Voltage :
- 3V
- HTS Code :
- 8542.32.00.51
- Number of Functions :
- 1
- Height Seated (Max) :
- 2.64mm
- Interface :
- SPI, Serial
- Write Protection :
- HARDWARE/SOFTWARE
- Terminal Pitch :
- 1.27mm
- Data Retention Time-Min :
- 20
- RoHS Status :
- ROHS3 Compliant
- Length :
- 10.31mm
- Packaging :
- Tube
- Page Size :
- 256B
- Programming Voltage :
- 2.7V
- Nominal Supply Current :
- 18mA
- Number of Terminations :
- 16
- Supply Voltage-Max (Vsup) :
- 3.6V
- Mounting Type :
- Surface Mount
- Terminal Position :
- Dual
- Published :
- 2010
- Standby Current-Max :
- 0.000005A
- Supply Voltage-Min (Vsup) :
- 2.7V
- Number of Pins :
- 16
- Memory Interface :
- SPI
- Sync/Async :
- SYNCHRONOUS
- Memory Width :
- 8
- Pin Count :
- 16
- Mount :
- Surface Mount
- Package / Case :
- 16-SOIC (0.295, 7.50mm Width)
- Serial Bus Type :
- SPI
- Organization :
- 8MX8
- Operating Supply Voltage :
- 3.3V
- Write Cycle Time - Word, Page :
- 3ms
- Memory Format :
- Flash
- Memory Size :
- 64Mb 8M x 8
- Memory Type :
- Non-Volatile
- ECCN Code :
- 3A991.B.1.A
- Series :
- SpiFlash®
- Radiation Hardening :
- No
- Address Bus Width :
- 1b
- Endurance :
- 100000 Write/Erase Cycles
- Word Size :
- 1b
- Clock Frequency :
- 80MHz
- Density :
- 64 Mb
- Access Time :
- 7 ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- W25Q64BVSFIG

Memory Winbond Electronics Corporation W25Q64BVSFIG Overview
The Memory Winbond Electronics Corporation W25Q64BVSFIG is a high-performance 64Mbit SPI Flash memory device, ideal for applications requiring storage and data retrieval at high speeds, up to 80 MHz. This component from Winbond Electronics Corporation features a 16-pin SOIC package, ensuring compact integration and ease of PCB layout design in sophisticated electronics systems. The robust design and enhanced endurance provide reliable storage solutions for a wide range of industrial applications, making it a crucial component for developers looking to optimize memory-intensive operations.
W25Q64BVSFIG Features
This Flash memory IC boasts several features that make it stand out in its category. It offers a substantial 64Mbit of storage capacity, high-speed performance at 80MHz, and operates via a SPI interface, ensuring simplicity in connectivity and functionality. The 16SOIC packaging allows for a streamlined integration into various electronic assemblies, enhancing system reliability and reducing overall footprint. Its high-speed data transfer capabilities make it suitable for environments requiring quick access to large volumes of data.
W25Q64BVSFIG Applications
- Data Storage Devices: Utilized in external and internal storage solutions for high-speed data logging and retrieval.
- Consumer Electronics: Integral in applications such as smartphones, tablets, and other portable devices where efficient and fast storage memory is crucial.
- Embedded Systems: Provides the memory backbone for microcontroller-based applications, from automotive systems to industrial machines.
- Internet of Things (IoT) Devices: Employs its high-speed interface and robust storage capabilities in connected devices that require rapid data access and real-time processing.
- Gaming Consoles: Used to enhance gaming experiences through fast game loading times and performance enhancements.
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