W25Q32JVSSIM

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Maximum Operating Temperature (°C) :

85

Program Current (mA) :

25

Architecture :

Sectored

Supplier Temperature Grade :

Industrial

Package Width :

5.28

Chip Density (bit) :

32M

Block Organization :

Symmetrical

Minimum Endurance (Cycles) :

100000

Page Size :

256byte

Packaging :

Tube

Operating Current (mA) :

25

ECC Support :

No

Number of Bits/Word (bit) :

8

Timing Type :

SYNCHRONOUS

Lead Shape :

Gull-wing

Interface Type :

Serial (SPI, Dual SPI, Quad SPI)

Location of Boot Block :

Bottom|Top

Package Length :

5.28

EU RoHS :

Compliant

PCB changed :

8

Typical Operating Supply Voltage (V) :

3|3.3

ECCN (US) :

3A991.B.1.A

Sector Size :

4Kbyte x 1024

Maximum Programming Time (ms) :

3/Page

Number of Words :

4m

Mounting :

Surface Mount

Maximum Operating Supply Voltage (V) :

3.6

Minimum Operating Temperature (°C) :

-40

PPAP :

No

Cell Type :

NOR

Automotive :

No

Command Compatible :

yes

Maximum Erase Time (S) :

50/Chip

Support of Page Mode :

No

Standard Package Name :

SOP

Programmability :

yes

Max. Access Time (ns) :

6

Programming Voltage (V) :

2.7 to 3.6

Address Bus Width (bit) :

24

Minimum Operating Supply Voltage (V) :

2.7

Pin Count :

8

Package Height :

1.8

Supplier Package :

SOIC W

Boot Block :

yes