W25Q256FVFIQ
- Mfr.Part #
- W25Q256FVFIQ
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 16-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Stock
- 29,121
- In Stock :
- 29,121
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Packaging :
- Tube
- Write Protection :
- HARDWARE/SOFTWARE
- Memory Density :
- 268435456 bit
- Supply Voltage :
- 3V
- Published :
- 2016
- Qualification Status :
- Not Qualified
- Write Cycle Time - Word, Page :
- 50μs, 3ms
- JESD-30 Code :
- R-PDSO-G16
- Memory Type :
- Non-Volatile
- Supply Voltage-Max (Vsup) :
- 3.6V
- Package / Case :
- 16-SOIC (0.295, 7.50mm Width)
- RoHS Status :
- ROHS3 Compliant
- Operating Mode :
- SYNCHRONOUS
- Number of Functions :
- 1
- Series :
- SpiFlash®
- Supply Voltage-Min (Vsup) :
- 2.7V
- Data Retention Time-Min :
- 20
- Clock Frequency :
- 104MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Current-Max :
- 0.025mA
- Width :
- 7.49mm
- Memory Size :
- 256Mb 32M x 8
- Organization :
- 256MX1
- Terminal Position :
- Dual
- Factory Lead Time :
- 14 Weeks
- Standby Current-Max :
- 0.000025A
- Number of Terminations :
- 16
- Endurance :
- 100000 Write/Erase Cycles
- Operating Temperature :
- -40°C~85°C TA
- Memory Width :
- 1
- Serial Bus Type :
- SPI
- Mounting Type :
- Surface Mount
- Interface :
- SPI, Serial
- Memory Interface :
- SPI - Quad I/O, QPI
- Memory Format :
- Flash
- Voltage - Supply :
- 2.7V~3.6V
- Surface Mount :
- yes
- Power Supplies :
- 3/3.3V
- Programming Voltage :
- 3V
- Terminal Pitch :
- 1.27mm
- Length :
- 10.31mm
- Height Seated (Max) :
- 2.64mm
- Datasheets
- W25Q256FVFIQ

Memory Winbond Electronics Corporation W25Q256FVFIQ Overview
Introducing the Winbond Electronics Corporation W25Q256FVFIQ, a high-performance 256Mbit flash memory device that stands at the forefront of the SPI and Quad-SPI communication interface technology. This Memory Winbond Electronics Corporation W25Q256FVFIQ is specifically designed to meet the rigorous demands of high-speed data transfer and reliable storage across a variety of applications. With its compact 16-SOIC package, it provides a robust solution for enhancing the performance and reliability of embedded systems. This product is ideal for manufacturers looking to integrate high capacity memory with minimal footprint into their designs, thereby supporting sophisticated applications that require high-speed and high-density memory storage.
W25Q256FVFIQ Features
The W25Q256FVFIQ flash memory module includes several key features that make it an excellent choice for a wide range of applications. Key features include a large 256Mbit storage capacity, support for Standard SPI, Dual SPI, and Quad SPI interfaces for enhanced bandwidth, and high data transfer speeds. The device also offers a flexible erase capability with sectors of 4KB each, alongside a 64KB block size, enabling efficient usage and management of data. Its high reliability is affirmed by a 20-year data retention capability and endurance of 100,000 program-erase cycles.
W25Q256FVFIQ Applications
- Consumer Electronics: Utilized in devices like digital cameras, gaming consoles, and smart TVs for storing firmware and user settings where fast data access and reliability are essential.
- Mobile Devices: Supports advanced mobile applications in smartphones and tablets by providing extended storage for operating system updates and application data, ensuring smooth and fast device performance.
- Internet of Things (IoT): Employs in a multitude of IoT devices, facilitating efficient data logging and firmware updates that are critical for smart home and industrial automation systems.
- Automotive Electronics: Ideal for use in advanced driver-assistance systems (ADAS), infotainment systems, and dashboard electronics where long-term reliability and high-speed read/write capabilities are required.
- Industrial Applications: Serves in industrial control systems, providing robust, reliable data storage for critical applications that operate under extreme conditions and require data integrity and security.
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