W25Q256FVEJQ
- Mfr.Part #
- W25Q256FVEJQ
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 8-WDFN Exposed Pad
- Datasheet
- Download
- Description
- IC FLASH 256MBIT SPI/QUAD 8WSON
- Stock
- 19,983
- In Stock :
- 19,983
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Memory Format :
- Flash
- Package / Case :
- 8-WDFN Exposed Pad
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 8
- Organization :
- 256MX1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Parallel/Serial :
- Serial
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tube
- Terminal Position :
- Dual
- Number of Functions :
- 1
- JESD-30 Code :
- R-PDSO-N8
- Clock Frequency :
- 104MHz
- Voltage - Supply :
- 2.7V~3.6V
- Memory Density :
- 268435456 bit
- Series :
- SpiFlash®
- Width :
- 6mm
- Supply Voltage-Min (Vsup) :
- 2.7V
- Memory Width :
- 1
- Supply Voltage :
- 3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Height Seated (Max) :
- 0.8mm
- Memory Size :
- 256Mb 32M x 8
- Terminal Pitch :
- 1.27mm
- HTS Code :
- 8542.32.00.51
- Operating Mode :
- SYNCHRONOUS
- ECCN Code :
- 3A991.B.1.A
- Memory Type :
- Non-Volatile
- Write Cycle Time - Word, Page :
- 50μs, 3ms
- Programming Voltage :
- 3V
- Length :
- 8mm
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~105°C TA
- Surface Mount :
- yes
- Memory Interface :
- SPI - Quad I/O, QPI
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- W25Q256FVEJQ

Memory Winbond Electronics Corporation W25Q256FVEJQ Overview
The Winbond W25Q256FVEJQ is a cutting-edge 256Mbit Flash memory chip that utilizes both SPI and Quad-SPI interfaces for high-speed data transmission. This IC is designed to meet the demanding requirements of high storage applications, offering reliable data retention and efficient read/write operations. Ideal for a range of advanced electronic applications, the W25Q256FVEJQ from Winbond provides a robust solution for data-intensive tasks, ensuring optimal performance in compact 8WSON packages. Its versatility and high capacity make it a top choice for manufacturers looking to enhance system performance while maintaining cost-efficiency and space savings. The Memory Winbond Electronics Corporation W25Q256FVEJQ is engineered for scalability and innovation, facilitating bulk purchases and deployment in commercial applications.
W25Q256FVEJQ Features
The W25Q256FVEJQ Flash memory chip includes several key features such as its 256Mbit storage capacity, dual/quad SPI modes for faster throughput, and a compact 8WSON package that minimizes board space. It supports the standard Serial Peripheral Interface as well as a high-performance Quad-SPI interface, enabling high-speed data transfer rates. The device also boasts low power consumption, advanced security features including lockable sectors, and a wide operating temperature range, making it suitable for a variety of industrial environments.
W25Q256FVEJQ Applications
- Consumer Electronics: Used in devices like smartphones, tablets, and other portable gadgets for efficient data storage and fast access speeds.
- Automotive Systems: Integrates into automotive infotainment systems to store navigational data, firmware, and user-defined settings, enhancing the in-vehicle experience.
- Industrial Automation: Provides robust data solutions for machinery and control systems, facilitating advanced logging and real-time system updates.
- Internet of Things (IoT) Devices: Essential for IoT devices requiring high-speed data transfer and large storage capacity for effective device-to-device communication and updates.
- Wearable Technology: Perfect for wearables, offering compact, reliable storage for user data, device settings, and application codebases in a power-efficient manner.
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