W25Q256FVCBQ

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Surface Mount :

yes

Supplier Device Package :

24-TFBGA (6x8)

Package Shape :

RECTANGULAR

Voltage - Supply :

2.7V ~ 3.6V

Memory Density :

268435456 bit

Number of Functions :

1

ECCN Code :

3A991.B.1.A

Access Time :

7 ns

Supply Voltage-Min (Vsup) :

2.7 V

Package / Case :

24-TBGA

Organization :

256MX1

Memory Type :

Non-Volatile

Reach Compliance Code :

Compliant

Mounting Type :

Surface Mount

HTS Code :

8542.32.00.51

Memory Size :

256Mbit

Parallel/Serial :

Serial

Supply Voltage-Max (Vsup) :

3.6 V

Terminal Position :

BOTTOM

Programming Voltage :

3 V

Operating Temperature :

-40°C ~ 85°C (TA)

Write Cycle Time - Word, Page :

50μs, 3ms

Product Status :

Obsolete

Base Product Number :

W25Q256

Package :

Tube

Memory Width :

1

Memory Format :

Flash

Type :

NOR TYPE

Length :

8 mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Series :

SpiFlash®

Temperature Grade :

Industrial

JESD-30 Code :

R-PBGA-B24

Operating Mode :

SYNCHRONOUS

Memory Interface :

SPI - Quad I/O, QPI

Clock Frequency :

104 MHz

Seated Height-Max :

1.2 mm

Number of Terminals :

24

Memory Organization :

32M x 8

Memory IC Type :

Flash

Width :

6 mm

Terminal Form :

Ball

Number of Words :

268435456 words

Terminal Pitch :

1 mm