W25Q16VSSIG
- Mfr.Part #
- W25Q16VSSIG
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 8-SOIC (0.209, 5.30mm Width)
- Datasheet
- Download
- Description
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- Stock
- 6,639
- In Stock :
- 6,639
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Standby Current-Max :
- 0.000005A
- Write Protection :
- HARDWARE/SOFTWARE
- Packaging :
- Tube
- Memory Format :
- Flash
- Supply Voltage :
- 3V
- Operating Temperature :
- -40°C~85°C TA
- Operating Mode :
- SYNCHRONOUS
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1.27mm
- Terminal Position :
- Dual
- Serial Bus Type :
- SPI
- Surface Mount :
- yes
- Number of Functions :
- 1
- Interface :
- SPI, Serial
- Reach Compliance Code :
- Unknown
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 8
- JESD-30 Code :
- S-PDSO-G8
- Memory Size :
- 16Mb 2M x 8
- Terminal Finish :
- Matte Tin (Sn)
- JESD-609 Code :
- e3
- Endurance :
- 100000 Write/Erase Cycles
- Programming Voltage :
- 2.7V
- Supply Voltage-Min (Vsup) :
- 2.7V
- RoHS Status :
- ROHS3 Compliant
- Supply Current-Max :
- 0.018mA
- Number of Terminations :
- 8
- Data Retention Time-Min :
- 20
- Voltage - Supply :
- 2.7V~3.6V
- Organization :
- 2MX8
- Series :
- SpiFlash®
- Clock Frequency :
- 80MHz
- Published :
- 2016
- Memory Density :
- 16777216 bit
- Width :
- 5.28mm
- Height Seated (Max) :
- 2.16mm
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Supply Voltage-Max (Vsup) :
- 3.6V
- Package / Case :
- 8-SOIC (0.209, 5.30mm Width)
- Peak Reflow Temperature (Cel) :
- 260
- ECCN Code :
- EAR99
- Memory Width :
- 8
- Write Cycle Time - Word, Page :
- 50μs, 3ms
- Power Supplies :
- 3/3.3V
- Length :
- 5.28mm
- Memory Interface :
- SPI - Quad I/O
- Memory Type :
- Non-Volatile
- HTS Code :
- 8542.32.00.51
- Datasheets
- W25Q16VSSIG

Memory Winbond Electronics Corporation W25Q16VSSIG Overview
The Memory Winbond Electronics Corporation W25Q16VSSIG IC is a pivotal component designed for advanced electronic applications, boasting a 16Mbit storage capacity and a flexible SPI/Quad interface in a compact 8SOIC package. This flash memory device offers robust performance and reliability for a variety of demanding applications, making it a preferred choice for developers and manufacturers looking to integrate high-speed and durable memory solutions. Its capabilities ensure optimal data integrity and quick access, enhancing the overall efficiency and effectiveness of electronic systems.
W25Q16VSSIG Features
The W25Q16VSSIG from Winbond Electronics Corporation stands out with its high-speed SPI/Quad interface which enables fast read and write operations essential for real-time applications. It includes a 16MB memory capacity that accommodates substantial data without the need for frequent erasing. The small 8SOIC package is ideal for compact PCB layouts, making it suitable for portable electronic devices. Furthermore, its low power consumption enhances the battery life of mobile applications, providing a crucial advantage in energy-sensitive designs.
W25Q16VSSIG Applications
- Mobile Devices: Utilized in smartphones and tablets to store firmware and application data, enhancing device responsiveness and user experience.
- Consumer Electronics: Integral for settings storage in devices like digital cameras and gaming consoles, where durability and data integrity are crucial.
- Internet of Things (IoT) Devices: Provides reliable data storage for IoT devices, ensuring efficient operation in smart home systems and wearable technology.
- Automotive Electronics: Applied in car infotainment systems to store navigational data and user settings, contributing to a seamless automotive experience.
- Industrial Automation: Used in control systems for data logging and real-time system updates, critical for maintaining high levels of accuracy and reliability in industrial environments.
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