W25Q16JLSSIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Package Length :

5.28

Programmability :

yes

Maximum Operating Frequency (MHz) :

104

Package Height :

1.8

ECC Support :

No

Number of Words :

2m

Lead Shape :

Gull-wing

Automotive :

No

Number of Bits/Word (bit) :

8

PCB changed :

8

Sector Size :

4Kbyte x 512

Program Current (mA) :

25

Minimum Operating Supply Voltage (V) :

2.3

Supplier Package :

SOIC

Mounting :

Surface Mount

Support of Page Mode :

No

Supplier Temperature Grade :

Industrial

Block Organization :

Symmetrical

Maximum Operating Temperature (°C) :

85

Typical Operating Supply Voltage (V) :

2.5|3.3

Maximum Operating Supply Voltage (V) :

3.6

Command Compatible :

yes

Chip Density (bit) :

16m

Page Size :

256byte

Interface Type :

Serial (SPI, Dual SPI, Quad SPI)

Pin Count :

8

Maximum Programming Time (ms) :

3/Page

Minimum Operating Temperature (°C) :

-40

Cell Type :

NOR

Maximum Erase Time (S) :

25/Chip

Minimum Endurance (Cycles) :

100000

Address Bus Width (bit) :

24

Boot Block :

No

ECCN (US) :

EAR99

Architecture :

Sectored

Operating Current (mA) :

25

EU RoHS :

Compliant

Timing Type :

SYNCHRONOUS

PPAP :

No

Programming Voltage (V) :

2.3 to 3.6

Max. Access Time (ns) :

6

Packaging :

Tube

Package Width :

5.28

Standard Package Name :

SOP