W25Q16DVSNJP

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Width :

3.9mm

Parallel/Serial :

Serial

Surface Mount :

yes

Terminal Finish :

MATTE TIN

Series :

SpiFlash®

Supply Voltage-Min (Vsup) :

2.7V

Programming Voltage :

2.7V

Memory Type :

Non-Volatile

Serial Bus Type :

SPI

Terminal Position :

Dual

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - Supply :

2.7V~3.6V

Power Supplies :

3/3.3V

Number of Terminations :

8

Number of Functions :

1

Data Retention Time-Min :

20

Pin Count :

8

Packaging :

Tube

Standby Current-Max :

0.000025A

Memory Width :

1

Write Cycle Time - Word, Page :

50μs, 3ms

Organization :

16MX1

Memory Interface :

SPI - Quad I/O

JESD-609 Code :

e3

Memory Density :

16777216 bit

Write Protection :

HARDWARE/SOFTWARE

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage :

3V

Operating Mode :

SYNCHRONOUS

Memory Format :

Flash

Qualification Status :

Not Qualified

Clock Frequency :

104MHz

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Pbfree Code :

yes

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Pitch :

1.27mm

Mounting Type :

Surface Mount

Endurance :

100000 Write/Erase Cycles

Height Seated (Max) :

1.75mm

Memory Size :

16Mb 2M x 8

Supply Current-Max :

0.03mA

JESD-30 Code :

R-PDSO-G8

Package / Case :

8-SOIC (0.154, 3.90mm Width)

RoHS Status :

ROHS3 Compliant

Length :

4.9mm

Operating Temperature :

-40°C~105°C TA