W25Q128FVCIG
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- Mfr.Part #
- W25Q128FVCIG
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 24-TBGA
- Datasheet
- Download
- Description
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- Stock
- 6,289
- In Stock ：
- 6,289
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Memory Size :
- 128Mb 16M x 8
- Supply Voltage-Max (Vsup) :
- 3.6V
- Published :
- 2012
- Number of Functions :
- 1
- Supply Voltage-Min (Vsup) :
- 2.7V
- HTS Code :
- 8542.32.00.51
- Memory Width :
- 1
- RoHS Status :
- ROHS3 Compliant
- Memory Format :
- Flash
- Serial Bus Type :
- SPI
- Programming Voltage :
- 3V
- Organization :
- 128MX1
- Pin Count :
- 24
- Memory Density :
- 134217728 bit
- Endurance :
- 100000 Write/Erase Cycles
- Operating Mode :
- SYNCHRONOUS
- Write Protection :
- HARDWARE/SOFTWARE
- Length :
- 8mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 3/3.3V
- Standby Current-Max :
- 0.00002A
- Package / Case :
- 24-TBGA
- ECCN Code :
- 3A991.B.1.A
- Supply Current-Max :
- 0.02mA
- Surface Mount :
- yes
- Clock Frequency :
- 104MHz
- Qualification Status :
- Not Qualified
- Memory Type :
- Non-Volatile
- Supply Voltage :
- 3V
- Data Retention Time-Min :
- 20
- Memory Interface :
- SPI - Quad I/O, QPI
- Operating Temperature :
- -40°C~85°C TA
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 24
- Packaging :
- Tube
- Voltage - Supply :
- 2.7V~3.6V
- Number of Pins :
- 24
- Height Seated (Max) :
- 1.2mm
- Width :
- 6mm
- Interface :
- SPI, Serial
- Terminal Position :
- BOTTOM
- Series :
- SpiFlash®
- Write Cycle Time - Word, Page :
- 50μs, 3ms
- Mounting Type :
- Surface Mount
- Datasheets
- W25Q128FVCIG
Memory Winbond Electronics Corporation W25Q128FVCIG Overview
The Winbond W25Q128FVCIG represents a powerful solution in the field of digital storage. This 128M-bit Flash memory chip, designed by Winbond Electronics Corporation, offers high-speed SPI/Quad interface capabilities housed in a compact 24-TFBGA package. Specifically engineered for efficiency and reliability, the W25Q128FVCIG is ideal for advanced applications requiring substantial data storage without compromising on performance. Integrating this chip into your products ensures a balance of durability, speed, and scalability, making it a prime choice for developers looking to enhance system capabilities with high-density, non-volatile memory. The strategic use of the Memory Winbond Electronics Corporation W25Q128FVCIG in your designs can significantly uplift the performance and reliability of your applications.
W25Q128FVCIG Features
This Flash memory chip features a 128-Mbit storage capacity with dual/quad SPI interfaces, allowing for high-speed data transfer rates. The device supports the standard Serial Peripheral Interface (SPI), Dual SPI, and Quad SPI operation, enabling improved overall performance. Its package size of 24-TFBGA is ideal for compact PCB layouts, providing substantial storage within a small footprint. Additionally, the W25Q128FVCIG is designed for flexible usage across a wide range of operating temperatures, making it suitable for various industrial applications.
W25Q128FVCIG Applications
- Consumer Electronics: Used in devices like smartphones, tablets, and digital cameras for efficient storage of large volumes of data.
- Internet of Things (IoT) Devices: Enables enhanced data logging and firmware updates in smart home devices, wearables, and other connected systems.
- Automotive Applications: Provides reliable data storage for advanced driver-assistance systems (ADAS) and infotainment systems, ensuring fast and consistent access to crucial data.
- Industrial Control: Integral in the storage of configuration and operational data in industrial automation systems, improving resilience and operational efficiency.
- Portable Medical Devices: Utilized in medical monitoring equipment, offering robust data integrity for critical patient information storage.
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