W25N01GWTBIG TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Supplier Package :

TFBGA

Chip Density (bit) :

1G

EU RoHS :

Compliant

Packaging :

Tray

Maximum Programming Time (ms) :

0.7/Page

Command Compatible :

yes

Sector Size :

128Kbyte x 1024

PCB changed :

24

Max. Access Time (ns) :

8

Cell Type :

NAND

Supplier Temperature Grade :

Industrial

Programmability :

yes

Minimum Operating Temperature (°C) :

-40

Boot Block :

No

Package Width :

6

Timing Type :

SYNCHRONOUS

Support of Page Mode :

No

Programming Voltage (V) :

1.7 to 1.95

Package Height :

0.85

Interface Type :

Serial (SPI, Dual SPI, Quad SPI)

Maximum Erase Time (S) :

0.01/Block

Number of Words :

128M

Maximum Operating Temperature (°C) :

85

Pin Count :

24

Minimum Endurance (Cycles) :

100000

Automotive :

No

Operating Current (mA) :

35

ECC Support :

yes

Block Organization :

Symmetrical

Maximum Operating Supply Voltage (V) :

1.95

Number of Bits/Word (bit) :

8

Mounting :

Surface Mount

Minimum Operating Supply Voltage (V) :

1.7

Address Bus Width (bit) :

32

PPAP :

No

Package Length :

8

ECCN (US) :

3A991.B.1.A

Typical Operating Supply Voltage (V) :

1.8

Program Current (mA) :

35

Architecture :

Sectored

Page Size :

2Kbyte