W25N01GVZEIG TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Number of Functions :

1

Memory Size :

1Gb 128M x 8

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Voltage - Supply :

2.7V~3.6V

Series :

SpiFlash®

Organization :

1GX1

Width :

6mm

HTS Code :

8542.32.00.51

Memory Type :

Non-Volatile

Mounting Type :

Surface Mount

Factory Lead Time :

10 Weeks

Programming Voltage :

3V

Terminal Position :

Dual

Memory Width :

1

ECCN Code :

3A991.B.1.A

Height Seated (Max) :

0.8mm

Parallel/Serial :

Serial

Package / Case :

8-WDFN Exposed Pad

Supply Voltage :

3V

Packaging :

Tape and Reel (TR)

Memory Interface :

SPI

Supply Voltage-Max (Vsup) :

3.6V

RoHS Status :

ROHS3 Compliant

Supply Voltage-Min (Vsup) :

2.7V

Published :

2016

Clock Frequency :

104MHz

Memory Density :

1073741824 bit

Memory Format :

Flash

Operating Mode :

SYNCHRONOUS

Surface Mount :

yes

Operating Temperature :

-40°C~85°C TA

Terminal Pitch :

1.27mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

R-PDSO-N8

Number of Terminations :

8

Length :

8mm