W25N01GVZEIG TR

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Width :

6mm

Package / Case :

8-WDFN Exposed Pad

ECCN Code :

3A991.B.1.A

Terminal Pitch :

1.27mm

Factory Lead Time :

10 Weeks

Organization :

1GX1

Memory Density :

1073741824 bit

Memory Interface :

SPI

Number of Terminations :

8

Memory Type :

Non-Volatile

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.6V

HTS Code :

8542.32.00.51

Memory Format :

Flash

Supply Voltage :

3V

Memory Width :

1

Voltage - Supply :

2.7V~3.6V

Mounting Type :

Surface Mount

Programming Voltage :

3V

Surface Mount :

yes

Number of Functions :

1

JESD-30 Code :

R-PDSO-N8

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Clock Frequency :

104MHz

Series :

SpiFlash®

Operating Temperature :

-40°C~85°C TA

Height Seated (Max) :

0.8mm

Parallel/Serial :

Serial

RoHS Status :

ROHS3 Compliant

Supply Voltage-Min (Vsup) :

2.7V

Published :

2016

Operating Mode :

SYNCHRONOUS

Memory Size :

1Gb 128M x 8

Packaging :

Tape and Reel (TR)

Terminal Position :

Dual

Length :

8mm