W25M02GVSFIG
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- Mfr.Part #
- W25M02GVSFIG
- Manufacturer
- Winbond Electronics Corporation
- Package / Case
- 16-SOIC (0.295, 7.50mm Width)
- Datasheet
- Download
- Description
- IC FLASH 2GBIT SPI 16SOP
- Stock
- 24,707
- In Stock ：
- 24,707
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- Manufacturer :
- Winbond Electronics Corporation
- Product Category :
- Memory
- Reach Compliance Code :
- Compliant
- Terminal Position :
- Dual
- Temperature Grade :
- Industrial
- Terminal Pitch :
- 1.27 mm
- Memory Size :
- 2Gbit
- Manufacturer :
- Winbond Electronics Corp
- Width :
- 7.49 mm
- Number of Words :
- 1073741824 words
- Memory Density :
- 2147483648 bit
- Surface Mount :
- yes
- JESD-30 Code :
- R-PDSO-G16
- Organization :
- 1GX2
- Terminal Form :
- Gull wing
- Number of Functions :
- 1
- Voltage - Supply :
- 2.7V ~ 3.6V
- Series :
- SpiFlash®
- Product Status :
- Obsolete
- Package / Case :
- 16-SOIC (0.295, 7.50mm Width)
- Base Product Number :
- W25M02
- Seated Height-Max :
- 2.64 mm
- Access Time :
- 7 ns
- Memory Format :
- Flash
- Type :
- SLC NAND TYPE
- Memory Width :
- 2
- Supply Voltage-Max (Vsup) :
- 3.6 V
- Memory Organization :
- 256M x 8
- Package :
- Tray
- Technology :
- FLASH - NAND (SLC)
- Clock Frequency :
- 104 MHz
- Memory Type :
- Non-Volatile
- Mounting Type :
- Surface Mount
- Write Cycle Time - Word, Page :
- 700µs
- Supplier Device Package :
- 16-SOIC
- Number of Terminals :
- 16
- Supply Voltage-Min (Vsup) :
- 2.7 V
- Length :
- 10.31 mm
- Memory IC Type :
- Flash
- Operating Mode :
- SYNCHRONOUS
- Programming Voltage :
- 3 V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package Shape :
- RECTANGULAR
- Parallel/Serial :
- Serial
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Memory Interface :
- SPI - Quad I/O
- Datasheets
- W25M02GVSFIG
Memory Winbond Electronics Corporation W25M02GVSFIG Overview
The Winbond Electronics Corporation W25M02GVSFIG is a cutting-edge integrated circuit specifically designed for robust digital storage solutions. As a dual-die stack of 1Gb Serial NOR flash memory, this component offers a substantial 2 Gbit of space, making it an indispensable choice for applications requiring high-density and reliable non-volatile memory. The integration of SPI interface ensures high-speed data transfer, enhancing system efficiency and performance. This Memory Winbond Electronics Corporation W25M02GVSFIG flash memory is a pivotal component in modern electronic systems where extensive memory, durability, and minimal power consumption are crucial.
W25M02GVSFIG Features
The W25M02GVSFIG comes packed with features that emphasize efficiency, reliability, and versatility:
- High Density: 2 Gbit capacity split over dual dies.
- SPI Interface: Enables fast data communication and simple integration into existing technology architectures.
- Standard 16SOP Package: Ensures compatibility with a wide range of hardware designs.
- Low Power Consumption: Ideal for applications where power efficiency is critical.
- Durability: Designed for extensive read/write cycles, ensuring longevity in high-demand environments.
W25M02GVSFIG Applications
- Consumer Electronics: Used in devices like smartphones, tablets, and cameras to provide high-capacity and reliable storage for user data and device firmware.
- Industrial Automation: Enhances the performance and reliability of automation controllers and sensors in tough industrial environments.
- Automotive: Critical for data logging and firmware storage in modern automotive electronics where durability and dependability are essential.
- Internet of Things (IoT) Devices: Provides the necessary storage capacity for firmware and data in smart home devices and other IoT applications.
- Portable Gaming Devices: Stores large amounts of game data and user settings, offering quick access and improved gameplay experience.
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