VSC8662XIC-03
- Mfr.Part #
- VSC8662XIC-03
- Manufacturer
- Microchip Technology
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 169
- In Stock :
- 169
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- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Microchip Technology
- Product Category :
- Telecom
- Factory Lead Time :
- 9 Weeks
- Operating Temperature :
- -
- Function :
- Ethernet
- Manufacturer :
- Microchip
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- S-PBGA-B256
- Operating Supply Voltage :
- 1.2 V, 3.3 V
- Current - Supply :
- -
- Minimum Operating Temperature :
- - 40 C
- Product Category :
- Ethernet ICs
- Interface Type :
- I2C, JTAG, MIIM, SGMII
- Brand :
- Microchip Technology / Atmel
- Maximum Operating Temperature :
- + 100 C
- Temperature Grade :
- Industrial
- Data Rate :
- 1.25 Gbps
- Duplex :
- Full Duplex, Half Duplex
- Package :
- Tray
- Voltage - Supply :
- -
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Packaging :
- Tray
- Height Seated (Max) :
- 2mm
- Number of Transceivers :
- 2
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supplier Device Package :
- 256-BGA (17x17)
- RoHS :
- Details
- Base Product Number :
- VSC8662
- Interface :
- -
- Terminal Position :
- BOTTOM
- Subcategory :
- Communication and Networking ICs
- Min Operating Temperature :
- -40°C
- Package / Case :
- 256-BGA
- Product :
- Ethernet Transceivers
- Series :
- VSC8662
- Terminal Form :
- Ball
- Product Status :
- Active
- Mounting Style :
- SMD/SMT
- Standard :
- 10/100/1GBASE-T
- Number of Circuits :
- 1
- Number of Terminations :
- 256
- Max Operating Temperature :
- 100°C
- Product Type :
- Ethernet ICs
- Supply Voltage :
- 1.2V
- Surface Mount :
- yes
- Datasheets
- VSC8662XIC-03

Telecom Microchip Technology VSC8662XIC-03 Overview
The VSC8662XIC-03, engineered by Microchip Technology, is a high-performance integrated circuit specifically designed for telecom interface applications. This IC is housed in a 256-ball grid array (BGA) package, ensuring robust performance and reliable connectivity. Ideal for advanced telecommunications systems, the VSC8662XIC-03 streamlines signal management and enhances data throughput, ensuring exceptional quality and performance. This product stands out in the competitive telecom industry by offering both efficiency and reliability, making it a preferred choice for manufacturers aiming for top-tier telecommunications solutions.
VSC8662XIC-03 Features
This IC includes multiple advanced features designed for high-demand telecom systems. Key features include high-speed signal processing capabilities, enhanced interface protocols, and support for multiple communication standards, making the VSC8662XIC-03 incredibly versatile and functional in a variety of telecommunication environments.
VSC8662XIC-03 Applications
- High-Speed Networks: Utilizes advanced signal processing to manage data flows efficiently, enhancing overall network reliability and performance.
- Telecommunication Switching Systems: Offers the robust interface capabilities needed to handle large volumes of simultaneous connections, improving system responsiveness and operational efficiency.
- Data Center Infrastructure: Supports high data rate transfers, critical for managing the vast amount of data processed daily in modern data centers.
- Wireless Base Stations: Provides the necessary processing power to support complex calculations and data handling required for modern wireless communication technologies.
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