VSC8662XIC-03

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Mfr.Part #
VSC8662XIC-03
Manufacturer
Microchip Technology
Package / Case
256-BGA
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
169
In Stock :
169

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Factory Lead Time :
9 Weeks
Operating Temperature :
-
Function :
Ethernet
Manufacturer :
Microchip
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
JESD-30 Code :
S-PBGA-B256
Operating Supply Voltage :
1.2 V, 3.3 V
Current - Supply :
-
Minimum Operating Temperature :
- 40 C
Product Category :
Ethernet ICs
Interface Type :
I2C, JTAG, MIIM, SGMII
Brand :
Microchip Technology / Atmel
Maximum Operating Temperature :
+ 100 C
Temperature Grade :
Industrial
Data Rate :
1.25 Gbps
Duplex :
Full Duplex, Half Duplex
Package :
Tray
Voltage - Supply :
-
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Packaging :
Tray
Height Seated (Max) :
2mm
Number of Transceivers :
2
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supplier Device Package :
256-BGA (17x17)
RoHS :
Details
Base Product Number :
VSC8662
Interface :
-
Terminal Position :
BOTTOM
Subcategory :
Communication and Networking ICs
Min Operating Temperature :
-40°C
Package / Case :
256-BGA
Product :
Ethernet Transceivers
Series :
VSC8662
Terminal Form :
Ball
Product Status :
Active
Mounting Style :
SMD/SMT
Standard :
10/100/1GBASE-T
Number of Circuits :
1
Number of Terminations :
256
Max Operating Temperature :
100°C
Product Type :
Ethernet ICs
Supply Voltage :
1.2V
Surface Mount :
yes
Datasheets
VSC8662XIC-03
Introducing Telecom Microchip Technology VSC8662XIC-03 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-, Mounting Type:Surface Mount, Package / Case:256-BGA, Number of Terminations:256, VSC8662XIC-03 pinout, VSC8662XIC-03 datasheet PDF, VSC8662XIC-03 amp .Beyond Telecom Microchip Technology VSC8662XIC-03 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology VSC8662XIC-03


Telecom Microchip Technology VSC8662XIC-03 Overview

The VSC8662XIC-03, engineered by Microchip Technology, is a high-performance integrated circuit specifically designed for telecom interface applications. This IC is housed in a 256-ball grid array (BGA) package, ensuring robust performance and reliable connectivity. Ideal for advanced telecommunications systems, the VSC8662XIC-03 streamlines signal management and enhances data throughput, ensuring exceptional quality and performance. This product stands out in the competitive telecom industry by offering both efficiency and reliability, making it a preferred choice for manufacturers aiming for top-tier telecommunications solutions.

VSC8662XIC-03 Features

This IC includes multiple advanced features designed for high-demand telecom systems. Key features include high-speed signal processing capabilities, enhanced interface protocols, and support for multiple communication standards, making the VSC8662XIC-03 incredibly versatile and functional in a variety of telecommunication environments.

VSC8662XIC-03 Applications

  • High-Speed Networks: Utilizes advanced signal processing to manage data flows efficiently, enhancing overall network reliability and performance.
  • Telecommunication Switching Systems: Offers the robust interface capabilities needed to handle large volumes of simultaneous connections, improving system responsiveness and operational efficiency.
  • Data Center Infrastructure: Supports high data rate transfers, critical for managing the vast amount of data processed daily in modern data centers.
  • Wireless Base Stations: Provides the necessary processing power to support complex calculations and data handling required for modern wireless communication technologies.
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