VSC8575XKS-14

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Mfr.Part #
VSC8575XKS-14
Manufacturer
Microchip Technology
Package / Case
256-BGA
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
27,124
In Stock :
27,124

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Current - Supply :
-
Supplier Device Package :
256-PBGA (17x17)
Package Shape :
Square
Maximum Operating Temperature :
+ 125 C
Product :
Ethernet Transceivers
Voltage - Supply :
1V
Base Product Number :
VSC8575
Number of Circuits :
4
Function :
Ethernet
RoHS Status :
ROHS3 Compliant
Product Type :
Ethernet ICs
Length :
17mm
Terminal Pitch :
1mm
Packaging :
Tray
Standard :
10/100/1GBASE-T
Surface Mount :
yes
Temperature Grade :
Automotive
Minimum Operating Temperature :
- 40 C
Pin Count :
256
Package :
Tray
Interface :
2-Wire Serial, JTAG, SerDes, SPI
Height Seated (Max) :
1.8mm
Operating Temperature (Max) :
125°C
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Number of Functions :
1
Number of Transceivers :
4 Transceiver
Telecom IC Type :
ETHERNET TRANSCEIVER
Terminal Form :
Ball
PHY Line Side Interface :
yes
Mounting :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Supply Voltage :
1 V
Reach Compliance Code :
Unknown
JESD-30 Code :
S-PBGA-B256
Factory Lead Time :
7 Weeks
Operating Temperature (Min) :
-40°C
Product Category :
Ethernet ICs
Standard Supported :
10 Base-T/100 Base-T/1000 Base-T
JTAG Support :
No
Number of Channels per Chip :
1
Subcategory :
Communication and Networking ICs
Number of Terminals :
256
Mounting Type :
Surface Mount
Operating Temperature :
-40 to 125 °C
Published :
2016
Terminal Position :
BOTTOM
Product Status :
Active
Interface Type :
QSGMII/SGMII/RGMII
Number of Terminations :
256
Manufacturer :
Microchip
Supply Voltage :
1V
RoHS :
Details
Mounting Style :
SMD/SMT
Integrated CDR :
No
Supplier Package :
BGA
Series :
VSC8575
Data Rate :
10 Mb/s, 100 Mb/s, 1 Gb/s
Brand :
Microchip Technology
Package / Case :
256-BGA
Seated Height-Max :
1.8 mm
Width :
17mm
Datasheets
VSC8575XKS-14
Introducing Telecom Microchip Technology VSC8575XKS-14 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40 to 125 °C, Number of Terminations:256, Package / Case:256-BGA, VSC8575XKS-14 pinout, VSC8575XKS-14 datasheet PDF, VSC8575XKS-14 amp .Beyond Telecom Microchip Technology VSC8575XKS-14 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology VSC8575XKS-14


Telecom Microchip Technology VSC8575XKS-14 Overview

The VSC8575XKS-14 from Microchip Technology represents a state-of-the-art IC telecom interface that caters specifically to advanced network management and signal integrity. This 256-pin BGA (Ball Grid Array) device is engineered to enhance the reliability and performance of high-speed networking systems. Integrating seamlessly into existing infrastructure, the VSC8575XKS-14 boosts system efficiency through its robust design and cutting-edge technology, making it an indispensable component for telecom operators aiming to optimize their network capabilities and throughput.

VSC8575XKS-14 Features

This IC telecom interface is designed with several key features that ensure superior performance in complex telecom environments. It supports high-speed signal processing capabilities, which are crucial for managing multiple data streams simultaneously. The VSC8575XKS-14 also offers low power consumption and minimal latency, enhancing the overall efficiency of telecom systems. Additionally, its compact 256BGA packaging allows for a smaller footprint on system boards, providing more space for other critical components.

VSC8575XKS-14 Applications

  • Network Routers: Employs advanced signal integrity features to manage data flow efficiently, ensuring robust and stable internet connectivity.
  • Switching Systems: Facilitates high-speed data transfer and switching capabilities, crucial for backbone networks and data centers.
  • Telecommunication Infrastructure: Serves as a core component in the development of scalable and flexible network platforms for telecommunications.
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