V29GL01GP11TFIR10

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Mfr.Part #
V29GL01GP11TFIR10
Manufacturer
Infineon Technologies
Package / Case
56-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 1GBIT PARALLEL 56TSOP
Stock
20,636
In Stock :
20,636

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Package / Case :
56-TFSOP (0.724, 18.40mm Width)
Series :
GL-P
Packaging :
Tray
Memory Format :
Flash
RoHS Status :
ROHS3 Compliant
Memory Type :
Non-Volatile
Voltage - Supply :
3V~3.6V
Memory Size :
1Gb 128M x 8
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Supplier Device Package :
56-TSOP
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
V29GL01GP11TFIR10
Introducing Memory Infineon Technologies V29GL01GP11TFIR10 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:56-TFSOP (0.724, 18.40mm Width), Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, V29GL01GP11TFIR10 pinout, V29GL01GP11TFIR10 datasheet PDF, V29GL01GP11TFIR10 amp .Beyond Memory Infineon Technologies V29GL01GP11TFIR10 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies V29GL01GP11TFIR10


Memory Infineon Technologies V29GL01GP11TFIR10 Overview

The Memory Infineon Technologies V29GL01GP11TFIR10 is a high-performance 1Gbit FLASH memory chip designed for a broad range of demanding applications. Manufactured by Infineon Technologies, this IC leverages advanced parallel interface technology housed in a compact 56TSOP package, ensuring both high-speed operation and reliable integration into existing systems. Targeting enterprise-level solutions, this memory chip excels in environments where large storage capacity and swift data access are crucial, making it an ideal choice for businesses looking to enhance their technology infrastructure with robust, scalable memory solutions.

V29GL01GP11TFIR10 Features

The V29GL01GP11TFIR10 from Infineon Technologies includes several key features that distinguish it in the market:

  • High Density Storage: 1Gbit of storage capacity allows for significant data storage in compact devices.
  • Parallel Interface: High-speed parallel interface ensures rapid data transfer rates, which is essential for high-performance computing and real-time applications.
  • Compact Form Factor: The 56TSOP package is designed for minimal space usage while providing maximum functionality, suitable for densely packed electronic assemblies.
  • Robust Reliability: Built to Infineon's rigorous quality standards, the chip is designed for long-term dependability across varied environmental conditions.

V29GL01GP11TFIR10 Applications

  • Enterprise Storage Systems: Utilized in data centers and enterprise storage systems for efficient, high-capacity data handling and storage.
  • Telecommunications Equipment: Helps manage and store large volumes of data in telecom infrastructures, enhancing performance and reliability of network operations.
  • Industrial Automation: Integral in the storage and retrieval of operational codes and configurations in automated production lines.
  • Consumer Electronics: Applied in devices such as set-top boxes and smart TVs, where large storage capacity and fast access to data are required for enhanced user experience.
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