TSV612AID

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Mfr.Part #
TSV612AID
Manufacturer
STMicroelectronics
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC CMOS 2 CIRCUIT 8SOIC
Stock
39,947
In Stock :
39,947

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Manufacturer :
STMicroelectronics
Product Category :
Instrumentation, OP Amps, Buffer Amps
Voltage - Supply, Single/Dual (±) :
1.5V~5.5V
Voltage Gain :
93dB
Base Part Number :
TSV612
Packaging :
Tube
Mount :
Surface Mount
Bias Current-Max (IIB) @25C :
0.00001μA
Lead Free :
Lead Free
Radiation Hardening :
No
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Output Current per Channel :
63mA
Peak Reflow Temperature (Cel) :
260
Nominal Supply Current :
14µA
Number of Functions :
2
Length :
4.9mm
Number of Channels :
2
Frequency Compensation :
yes
Architecture :
VOLTAGE-FEEDBACK
REACH SVHC :
No SVHC
RoHS Status :
ROHS3 Compliant
Terminal Form :
Gull wing
Low-Bias :
yes
ECCN Code :
EAR99
Output Type :
Rail-to-Rail
Mounting Type :
Surface Mount
Micropower :
yes
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Current :
10.5μA
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Amplifier Type :
GENERAL PURPOSE
Supply Voltage :
1.8V
Operating Temperature :
-40°C~85°C
Average Bias Current-Max (IIB) :
0.0001μA
Number of Terminations :
8
Supply Voltage Limit-Max :
6V
Low-Offset :
No
Unity Gain BW-Nom :
100 kHz
Output Current :
63mA
JESD-609 Code :
e4
Slew Rate :
0.04V/µs
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Height Seated (Max) :
1.75mm
Pin Count :
8
Number of Pins :
8
Common Mode Rejection Ratio :
64 dB
Bandwidth :
120 kHz
Current - Input Bias :
1pA
Terminal Position :
Dual
Input Offset Voltage (Vos) :
800μV
Introducing Instrumentation, OP Amps, Buffer Amps STMicroelectronics TSV612AID from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:TSV612, Number of Channels:2, Mounting Type:Surface Mount, Package / Case:8-SOIC (0.154, 3.90mm Width), Operating Temperature:-40°C~85°C, Number of Terminations:8, Number of Pins:8, Bandwidth:120 kHz, TSV612AID pinout, TSV612AID datasheet PDF, TSV612AID amp .Beyond Instrumentation, OP Amps, Buffer Amps STMicroelectronics TSV612AID ,we also offer OP07CDR, TS321CX5 RFG, NE5532ADR, Our vast inventory has you covered. Contact us now for immediate solutions.

STMicroelectronics TSV612AID


Instrumentation, OP Amps, Buffer Amps - STMicroelectronics TSV612AID Overview

Introducing the TSV612AID, an exemplary Integrated Circuit meticulously crafted by STMicroelectronics, tailored to meet the exacting demands of the instrumentation, operational amplifiers, and buffer amplifiers sector. This CMOS marvel boasts a sophisticated 2-circuit design ensconced within an 8SOIC package, promising unparalleled performance and versatility in myriad applications.

TSV612AID Features

  • Highly Integrated: The TSV612AID consolidates two circuits into a single, compact IC, streamlining design and assembly processes.
  • Precision Engineering: Crafted with CMOS technology, this IC delivers exceptional accuracy and reliability across a wide range of operating conditions.
  • Enhanced Flexibility: With its versatile design, the TSV612AID adapts effortlessly to diverse application requirements, ensuring optimal performance in every scenario.
  • Low Power Consumption: Despite its formidable capabilities, this IC maintains frugal power consumption, minimizing energy expenditure and maximizing efficiency.
  • Robust Construction: Built to withstand rigorous usage, the TSV612AID exemplifies durability and longevity, making it a steadfast companion in critical applications.

TSV612AID Applications

  • Industrial Automation Systems: The TSV612AID finds its niche in industrial automation setups, where its precision and reliability facilitate seamless control and monitoring processes.
  • Medical Instrumentation: Leveraging its high integration and accuracy, this IC powers advanced medical instruments, ensuring precise measurements and diagnostics.
  • Audio Signal Processing: In audio equipment such as mixers and amplifiers, the TSV612AID excels, delivering pristine signal amplification and processing for unparalleled sound quality.
  • Sensor Interfaces: Embedded within sensor interfaces, this IC enables efficient signal conditioning and amplification, enhancing the performance of sensing systems in various applications.
  • Communication Infrastructure: From data acquisition to signal buffering, the TSV612AID plays a pivotal role in communication infrastructure, optimizing signal integrity and transmission efficiency.
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