TSM-132-01-T-DV-P
- Mfr.Part #
- TSM-132-01-T-DV-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 64POS 2.54MM
- Stock
- 46,691
- In Stock :
- 46,691
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Dielectric Withstanding Voltage :
- 1000VAC V
- Pbfree Code :
- yes
- Termination :
- Solder
- Insulation Resistance :
- 5000000000Ohm
- Pitch - Mating :
- 0.100 2.54mm
- IEC Conformance :
- No
- Filter Feature :
- No
- JESD-609 Code :
- e3
- Number Of PCB Rows :
- 2
- Mixed Contacts :
- No
- Packaging :
- Tube
- Reference Standard :
- UL
- Material Flammability Rating :
- UL94 V-0
- Number of Conductors :
- ONE
- Shrouding :
- Unshrouded
- Number of Rows :
- 2
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Contact Material :
- Phosphor Bronze
- Contact Finish - Mating :
- Tin
- PCB Contact Pattern :
- RECTANGULAR
- Insulation Color :
- Black
- Gender :
- Male
- Fastening Type :
- Push-Pull
- Factory Lead Time :
- 3 Weeks
- Mating Contact Pitch :
- 0.1 inch
- Option :
- GENERAL PURPOSE
- Series :
- TSM
- Number of Positions Loaded :
- All
- Connector Type :
- Header
- Style :
- Board to Board or Cable
- Contact Length - Mating :
- 0.230 5.84mm
- Operating Temperature :
- -55°C~105°C
- Contact Type :
- Male Pin
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RoHS Status :
- ROHS3 Compliant
- MIL Conformance :
- No
- Additional Feature :
- E.L.P.
- Contact Shape :
- Square
- HTS Code :
- 8536.69.40.40
- Mounting Type :
- Surface Mount
- DIN Conformance :
- No
- ECCN Code :
- EAR99
- Reliability :
- COMMERCIAL
- Insulation Height :
- 0.100 2.54mm
- Number of Positions :
- 64
- Lead Free :
- Lead Free
- Feature :
- Pick and Place
- Total Number of Contacts :
- 64
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Datasheets
- TSM-132-01-T-DV-P

TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Tin Liquid Crystal Polymer (LCP) 64-Position Board to Board or Cable 0.100 2.54mm Height
TSM-132-01-T-DV-P Overview
The product is packaged in Header.This device is mounted in the Surface Mount position.It has been determined that a Tube case is necessary to package the product.There is a product in the TSM Series.To name a few, there is also E.L.P..There are a number of advantages to its Pick and Place feature.As a result, the device runs at -55°C~105°C Operating Temperature.
TSM-132-01-T-DV-P Features
TSM series
TSM-132-01-T-DV-P Applications
There are a lot of Samtec Inc.
TSM-132-01-T-DV-P Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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