TSM-130-04-L-DV-A-P
- Mfr.Part #
- TSM-130-04-L-DV-A-P
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 60POS 2.54MM
- Stock
- 45,900
- In Stock :
- 45,900
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- DIN Conformance :
- No
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Style :
- Board to Board or Cable
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Number of Positions Loaded :
- All
- PCB Contact Row Spacing :
- 4.953 mm
- Mounting Type :
- Surface Mount
- Fastening Type :
- Push-Pull
- Operating Temperature :
- -55°C~125°C
- Gender :
- Male
- Contact Material :
- Phosphor Bronze
- Number Of PCB Rows :
- 2
- Feature :
- Board Guide, Pick and Place
- Contact Shape :
- Square
- Contact Finish - Post :
- Tin
- Shrouding :
- Unshrouded
- Number of Rows :
- 2
- Filter Feature :
- No
- MIL Conformance :
- No
- Mixed Contacts :
- No
- Pitch - Mating :
- 0.100 2.54mm
- Mating Contact Pitch :
- 0.1 inch
- Material Flammability Rating :
- UL94 V-0
- Reliability :
- COMMERCIAL
- Insulation Height :
- 0.100 2.54mm
- Plating Thickness :
- 10μin
- Termination :
- Solder
- IEC Conformance :
- No
- Pbfree Code :
- yes
- Reach Compliance Code :
- not_compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Series :
- TSM
- Connector Type :
- Header
- RoHS Status :
- ROHS3 Compliant
- PCB Contact Pattern :
- RECTANGULAR
- Number of Conductors :
- ONE
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Number of Positions :
- 60
- Additional Feature :
- E.L.P.
- Contact Type :
- Male Pin
- Insulation Color :
- Black
- Total Number of Contacts :
- 60
- Factory Lead Time :
- 3 Weeks
- Contact Finish - Mating :
- Gold
- Body Depth :
- 0.15 inch
- JESD-609 Code :
- e3
- Contact Length - Mating :
- 0.120 3.05mm
- Option :
- GENERAL PURPOSE
- Packaging :
- Tube
- Lead Free :
- Lead Free
- Board Mounting Option :
- PEG
- Body Length or Diameter :
- 3 inch
- Datasheets
- TSM-130-04-L-DV-A-P
TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 60-Position Board to Board or Cable 0.100 2.54mm Height
TSM-130-04-L-DV-A-P Overview
It comes in Header packaging.The device's mounting type is Surface Mount.In order to package the product, a Tube case is used.It belongs to the TSM Series of products.In addition, there are other features such as E.L.P., to mention only a few.Its Board Guide, Pick and Place feature renders it more powerful in many ways.The device runs in -55°C~125°C Operating Temperature.
TSM-130-04-L-DV-A-P Features
TSM series
TSM-130-04-L-DV-A-P Applications
There are a lot of Samtec Inc.
TSM-130-04-L-DV-A-P Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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