TSM-130-03-L-DV

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Total Number of Contacts :

60

Plating Thickness :

10μin

Style :

Board to Board or Cable

Gender :

Male

Option :

GENERAL PURPOSE

Termination :

Solder

Series :

TSM

Row Spacing - Mating :

0.100 (2.54mm)

Filter Feature :

No

Insulation Material :

Liquid Crystal Polymer (LCP)

Length :

76.2mm

Feature :

Board Guide

Number of Positions Loaded :

All

Mounting Type :

Surface Mount

Contact Finish - Post :

Tin

Contact Finish - Mating :

Gold

PCB Contact Row Spacing :

5.4864 mm

Mixed Contacts :

No

Housing Color :

Black

Number Of PCB Rows :

2

Shrouding :

Unshrouded

Orientation :

Straight

Factory Lead Time :

3 Weeks

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Conductors :

ONE

Pitch - Mating :

0.100 2.54mm

HTS Code :

8536.69.40.40

MIL Conformance :

No

Insulation Resistance :

5000000000Ohm

Published :

2011

Lead Free :

Lead Free

Mount :

Surface Mount

Number of Rows :

2

Fastening Type :

Push-Pull

Reference Standard :

UL

Housing Material :

Polymer

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Max Voltage Rating (AC) :

475V

Reliability :

COMMERCIAL

Dielectric Withstanding Voltage :

1000VAC V

Packaging :

Tube

Contact Material :

Phosphor Bronze

Operating Temperature :

-55°C~125°C

Material Flammability Rating :

UL94 V-0

IEC Conformance :

No

RoHS Status :

ROHS3 Compliant

Contact Shape :

Square

JESD-609 Code :

e3

Depth :

5.08mm

Number of Positions :

60

Reach Compliance Code :

not_compliant

Insulation Height :

0.100 2.54mm

Connector Type :

Header

ECCN Code :

EAR99

Pbfree Code :

yes

Contact Type :

Male Pin

Mating Contact Pitch :

0.1 inch

Additional Feature :

E.L.P.

DIN Conformance :

No

PCB Contact Pattern :

RECTANGULAR

Contact Length - Mating :

0.420 10.67mm