TSM-126-01-LM-SH-TR
- Mfr.Part #
- TSM-126-01-LM-SH-TR
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD R/A 26POS 2.54MM
- Stock
- 21,679
- In Stock :
- 21,679
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Length - Mating :
- 0.230 5.84mm
- Number of Contacts :
- 26
- Contact Plating :
- Gold
- Factory Lead Time :
- 3 Weeks
- Style :
- Board to Board or Cable
- Number of Positions :
- 26
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Material :
- Phosphor Bronze
- Packaging :
- Tape and Reel (TR)
- Contact Type :
- Male Pin
- Material Flammability Rating :
- UL94 V-0
- Number of Positions Loaded :
- All
- Insulation Color :
- Black
- Pitch :
- 2.54mm
- Shrouding :
- Unshrouded
- Mounting Type :
- Surface Mount, Right Angle
- Contact Finish - Mating :
- Gold
- Connector Type :
- Header
- Number of Rows :
- 1
- Contact Finish - Post :
- Tin
- Contact Shape :
- Square
- Series :
- TSM
- Insulation Height :
- 0.120 3.05mm
- Gender :
- Male
- RoHS Status :
- ROHS3 Compliant
- Fastening Type :
- Push-Pull
- Termination :
- Solder
- Pitch - Mating :
- 0.100 2.54mm
- Operating Temperature :
- -55°C~125°C
- Datasheets
- TSM-126-01-LM-SH-TR

TSM Series 1-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount, Right Angle Gold Liquid Crystal Polymer (LCP) 26-Position Board to Board or Cable 0.120 3.05mm Height
TSM-126-01-LM-SH-TR Overview
A Header package is included with it.Its mounting type is Surface Mount, Right Angle.Packaging is performed using a Tape & Reel (TR) case.It is part of the TSM Series of products.There is no operating temperature for the device.
TSM-126-01-LM-SH-TR Features
TSM series
TSM-126-01-LM-SH-TR Applications
There are a lot of Samtec Inc.
TSM-126-01-LM-SH-TR Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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